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- Conditions sélectionnées:
Découvrez les produits 1,000
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Type | Frames per Second | Pixel Size | Active Pixel Array | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Type | Frames per Second | Pixel Size | Active Pixel Array | |
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4D Systems Pty Ltd |
203
|
3 jours |
-
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MOQ: 1 MPQ: 1
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MODULE MICRO SERIAL JPEG CAMERA
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Bulk | - | 4.5 V ~ 9 V | -30°C ~ 85°C | Module | - | CMOS | - | 5.5μm x 5.5μm | 656H x 496V | ||
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FLIR |
382
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
CAMERA IR 80X60 50 DEGREE 9HZ
|
Tray | Lepton | 2.8V | -10°C ~ 65°C (TA) | Module | Module | Thermal | 8.6 | 17μm x 17μm | 80H x 60V | ||
|
|
|
FLIR |
338
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CAMERA IR 80X60 50 DEG W/SHUTTER
|
Tray | Lepton | 2.8V | -10°C ~ 65°C (TA) | Module | Module | Thermal | 8.6 | 17μm x 17μm | 80H x 60V | ||
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|
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FLIR |
110
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CAMERA IR 80X60 25 DEGREE 9HZ
|
Tray | Lepton | 2.8V | -10°C ~ 65°C (TA) | Module | Module | Thermal | 8.6 | 17μm x 17μm | 80H x 60V | ||
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|
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FLIR |
532
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
LEPTON，80X60，50 DEGREE，WITH S
|
Tray | Lepton | 2.8V | -10°C ~ 65°C (TA) | Module | - | Thermal | 8.6 | 17μm x 17μm | 80H x 60V | ||
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|
|
FLIR |
1,236
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CAMERA IR 160X120 50DGR 9HZ REV3
|
Tray | Lepton | 2.8V | -10°C ~ 65°C | Module | - | Thermal | 8.800000000000001 | 12μm x 12μm | 160H x 120V | ||
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|
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Omron Electronics Inc-EMC Div |
27
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FACIAL RECOGNITION CAMERA 50 DEG
|
Bulk | HVC-P2 | 5V | 0°C ~ 50°C (TA) | Module | Module | Human Detection，Facial Recognition | - | - | 1600H x 1200V | ||
|
|
|
Omron Electronics Inc-EMC Div |
67
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FACIAL RECOGNITION CAMERA 90 DEG
|
Bulk | HVC-P2 | 5V | 0°C ~ 50°C (TA) | Module | Module | Human Detection，Facial Recognition | - | - | 1600H x 1200V | ||
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OmniVision Technologies Inc |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR CAMERA CMOS 20CAMERACUBE
|
Tape & Reel (TR) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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|
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OmniVision Technologies Inc |
3,809
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR CAMERA CMOS 20CAMERACUBE
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Cut Tape (CT) | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
3,809
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR CAMERA CMOS 20CAMERACUBE
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- | CameraCube | 2.8V | -30°C ~ 70°C (TA) | 20-CAMERACUBE | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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|
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OmniVision Technologies Inc |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tape & Reel (TR) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
7,123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Cut Tape (CT) | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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|
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OmniVision Technologies Inc |
7,123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
- | CameraCubeChip，OmniPixel3-HS | 2.8V | -30°C ~ 70°C (TJ) | 25-CSP | - | CMOS with Processor | 30 | 1.75μm x 1.75μm | 640H x 480V | ||
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OmniVision Technologies Inc |
2,093
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE CMOS VGA 32-CSP3
|
Tray | CameraChip，OmniPixel3-HS | 3.3V | -30°C ~ 70°C (TJ) | 32-CSP3 | - | CMOS | 30 | 4.2μm x 4.2μm | 656H x 488V | ||
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|
|
OmniVision Technologies Inc |
957
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniBSI | 2.8V | - | - | 66-CSP3 (6.5x6) | CMOS with Processor | 15 | 1.75μm x 1.75μm | 2592H x 1944V | ||
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|
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OmniVision Technologies Inc |
418
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniBSI | 2.8V | -30°C ~ 70°C (TA) | - | 116-CSP3 | CMOS with Processor | 15 | 1.4μm x 1.4μm | 4416H x 3312V | ||
|
|
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OmniVision Technologies Inc |
319
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniPixel3-HS | 3.3V | - | LGA | - | CMOS with Processor | 30 | 3μm x 3μm | 1280H x 800V | ||
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|
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OmniVision Technologies Inc |
101
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SENSOR IMAGE
|
Tray | OmniPixel3-HS | 3.3V | -20°C ~ 70°C (TA) | - | 62-aCSP (6.67 x 7.12) | CMOS with Processor | 30 | 6μm x 6μm | 752H x 480V | ||
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|
|
Texas Instruments |
768
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TOF SENSOR 78COG
|
Tape & Reel (TR) | - | 1.5 V ~ 3.3 V | 0°C ~ 70°C (TA) | 78-BGA Module | 78-COG (8.75x15.71) | 3D Time of Flight | 150 | - | 320H x 240V |
