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- Conditions sélectionnées:
Découvrez les produits 3,471
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 045 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 050 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
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- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 070 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP PCS SNSAT CTL
|
- | - | - | - | - | - | - | 1.090" (27.69mm) | - | - | - | |||
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 X BD 12--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.38 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 0.410" (10.41mm) | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | - | Adhesive | |||
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|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.09 X 0.19 BD 16--9-19UD-BD-16-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.090" (2.29mm) | 16.000" (406.40mm) | 0.190" (4.83mm) | Unplated | - | Adhesive | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 15.000" (381.00mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.90 BD 16--11-89RA-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | 0.890" (22.61mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.75 BD 16--12-75RS-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.750" (19.05mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 16.000" (406.40mm) | 0.220" (5.59mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.45 BD 16--8-45LPAH-BD-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 16.000" (406.40mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.37 NI 16--13-37AH-NI-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.281 BD 16--13-28U-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 NI 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 17.76--11-32AH-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 17.760" (451.10mm) | 0.320" (8.13mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.430"H X .500"W X 48"L--D SHAPED
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.430" (10.92mm) | 4.00 (1.22m) | 0.500" (12.70mm) | - | - | - |
