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- Operating Temperature：
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- Material：
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- Conditions sélectionnées:
Découvrez les produits 332
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
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TWT,STR,SNSAT,RA,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.176" (4.47mm) | 17.000" (433.22mm) | 0.295" (7.49mm) | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 15.000" (381.00mm) | 0.350" (8.89mm) | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USF,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.160" (4.06mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.210" (5.33mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 15.000" (381.00mm) | 0.450" (11.43mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.150" (3.81mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNSAT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 16.000" (406.40mm) | 0.380" (9.65mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.350" (8.89mm) | 16.000" (406.40mm) | 0.330" (8.38mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 16.000" (406.40mm) | 0.210" (5.33mm) | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 24.000" (609.60mm) | 0.780" (19.81mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,RAPSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | 299.21μin (7.60μm) | Adhesive |
