Découvrez les produits 5
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
4245PA51H00228
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
GK NICU PTAFG PU V0 REC
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.039" (1.00mm) 0.118" (3.00mm) - - Adhesive
97077000
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
DCON,25P,SS
121°C Fingerstock Stainless Steel - 0.025" (0.64mm) 0.690" (17.53mm) - - Slot
97082700
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
DCON,25P,BF
121°C Fingerstock Beryllium Copper - 0.025" (0.64mm) 0.360" (9.14mm) - - Slot
97078017
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
DCON,25P,SNB
121°C Fingerstock Beryllium Copper - 0.025" (0.64mm) 0.690" (17.53mm) Tin 299.21μin (7.60μm) Slot
97078000
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
DCON,25P,BF
121°C Fingerstock Beryllium Copper - 0.025" (0.64mm) 0.690" (17.53mm) - - Slot