- Material:
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- Shape:
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- Plating - Thickness:
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- Attachment Method:
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- Conditions sélectionnées:
Découvrez les produits 5
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | Fabric Over Foam | Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) | Rectangle | 0.039" (1.00mm) | 0.118" (3.00mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,SS
|
121°C | Fingerstock | Stainless Steel | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.360" (9.14mm) | - | - | Slot | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,SNB
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | Tin | 299.21μin (7.60μm) | Slot | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
DCON,25P,BF
|
121°C | Fingerstock | Beryllium Copper | - | 0.025" (0.64mm) | 0.690" (17.53mm) | - | - | Slot |