Découvrez les produits 5
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Height Width Plating Plating - Thickness Attachment Method
0C97043802
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
0.250" (6.35mm) 1.090" (27.69mm) - - Hardware,Rivet,Solder
0C97044017
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
CSTR COIL SNB
0.410" (10.41mm) 1.630" (41.40mm) Tin 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97044018
Laird Technologies EMI
Enquête
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-
MOQ: 1  MPQ: 1
CSTR COIL NIE
0.410" (10.41mm) 1.630" (41.40mm) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C98044002
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
CSTR COIL BF USF
0.410" (10.41mm) 1.630" (41.40mm) Unplated - Adhesive
0C97043816
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
CSTR COIL ZNY
0.250" (6.35mm) 1.090" (27.69mm) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder