- Series：
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- Operating Temperature：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 4
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Height | Length | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Height | Length | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,RA
|
- | 121°C | 0.110" (2.79mm) | 16.000" (406.40mm) | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
- | 121°C | 0.110" (2.79mm) | 16.000" (406.40mm) | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
FLX,STR,SNB
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- | 121°C | 0.230" (5.84mm) | 24.000" (609.60mm) | 299.21μin (7.60μm) | Snap-In | ||
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.10 X 0.26 SN 16--10-26UD-SN-16
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TechMESH | -55°C ~ 121°C | 0.110" (2.79mm) | 16.000" (406.40mm) | Flash | Adhesive |
