Contacts, doigts et joints - Zui Ai Technology（Taiwan）Company.

Operating Temperature：

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Plating：

Plating - Thickness：

Attachment Method：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Operating Temperature	Type	Shape	Height	Width	Plating	Plating - Thickness	Attachment Method
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Operating Temperature	Type	Shape	Height	Width	Plating	Plating - Thickness	Attachment Method
	BMI-C-006	Laird Technologies EMI	35,000	3 jours	-	CONTACT BECU 2.9X1.5MM MOQ: 1 MPQ: 1	CONTACT BECU 2.9X1.5MM	-	-	-	-	-	-	-	-
	BMI-C-006	Laird Technologies EMI	37,980	3 jours	-	CONTACT BECU 2.9X1.5MM MOQ: 1 MPQ: 1	CONTACT BECU 2.9X1.5MM	-	-	-	-	-	-	-	-
	BMI-C-006	Laird Technologies EMI	37,980	3 jours	-	CONTACT BECU 2.9X1.5MM MOQ: 1 MPQ: 1	CONTACT BECU 2.9X1.5MM	-	-	-	-	-	-	-	-
	BMI-C-001	Laird Technologies EMI	6,000	3 jours	-	CONTACT BECU 3.1X2.5MM MOQ: 1 MPQ: 1	CONTACT BECU 3.1X2.5MM	-	-	-	-	-	-	-	-
	BMI-C-001	Laird Technologies EMI	11,004	3 jours	-	CONTACT BECU 3.1X2.5MM MOQ: 1 MPQ: 1	CONTACT BECU 3.1X2.5MM	-	-	-	-	-	-	-	-
	BMI-C-001	Laird Technologies EMI	11,004	3 jours	-	CONTACT BECU 3.1X2.5MM MOQ: 1 MPQ: 1	CONTACT BECU 3.1X2.5MM	-	-	-	-	-	-	-	-
	BMI-C-007-01	Laird Technologies EMI	Enquête	-	-	CONTACT BECU 3.3X1.0MM MOQ: 1 MPQ: 1	CONTACT BECU 3.3X1.0MM	-	-	-	-	-	-	-	-
	BMI-C-007-01	Laird Technologies EMI	Enquête	-	-	CONTACT BECU 3.3X1.0MM MOQ: 1 MPQ: 1	CONTACT BECU 3.3X1.0MM	-	-	-	-	-	-	-	-
	BMI-C-007-01	Laird Technologies EMI	Enquête	-	-	CONTACT BECU 3.3X1.0MM MOQ: 1 MPQ: 1	CONTACT BECU 3.3X1.0MM	-	-	-	-	-	-	-	-
	TC-01-MINI	Leader Tech Inc.	Enquête	-	-	MINI TECH CLIP MOQ: 1 MPQ: 1	MINI TECH CLIP	-	-	-	-	-	-	-	-
	TC-01-MINI	Leader Tech Inc.	Enquête	-	-	MINI TECH CLIP MOQ: 1 MPQ: 1	MINI TECH CLIP	-	-	-	-	-	-	-	-
	TC-01-MINI	Leader Tech Inc.	Enquête	-	-	MINI TECH CLIP MOQ: 1 MPQ: 1	MINI TECH CLIP	-	-	-	-	-	-	-	-
	2199001-1	TE Connectivity AMP Connectors	120,000	3 jours	-	SHILEDFINGER1210EMBOSSPACKING MOQ: 1 MPQ: 1	SHILEDFINGER1210EMBOSSPACKING	-	Shield Finger，Pre-Loaded	-	0.041" (1.05mm)	0.047" (1.20mm)	Gold	19.685μin (0.50μm)	Solder
	2199001-1	TE Connectivity AMP Connectors	128,582	3 jours	-	SHILEDFINGER1210EMBOSSPACKING MOQ: 1 MPQ: 1	SHILEDFINGER1210EMBOSSPACKING	-	Shield Finger，Pre-Loaded	-	0.041" (1.05mm)	0.047" (1.20mm)	Gold	19.685μin (0.50μm)	Solder
	2199001-1	TE Connectivity AMP Connectors	128,582	3 jours	-	SHILEDFINGER1210EMBOSSPACKING MOQ: 1 MPQ: 1	SHILEDFINGER1210EMBOSSPACKING	-	Shield Finger，Pre-Loaded	-	0.041" (1.05mm)	0.047" (1.20mm)	Gold	19.685μin (0.50μm)	Solder
	1734303-1	TE Connectivity AMP Connectors	46,000	3 jours	-	SHIELD FINGER MOQ: 1 MPQ: 1	SHIELD FINGER	-	Shield Finger	-	0.157" (4.00mm)	0.098" (2.50mm)	Tin	100μin (2.54μm)	Solder
	1734303-1	TE Connectivity AMP Connectors	47,689	3 jours	-	SHIELD FINGER MOQ: 1 MPQ: 1	SHIELD FINGER	-	Shield Finger	-	0.157" (4.00mm)	0.098" (2.50mm)	Tin	100μin (2.54μm)	Solder
	1734303-1	TE Connectivity AMP Connectors	47,689	3 jours	-	SHIELD FINGER MOQ: 1 MPQ: 1	SHIELD FINGER	-	Shield Finger	-	0.157" (4.00mm)	0.098" (2.50mm)	Tin	100μin (2.54μm)	Solder
	2134078-1	TE Connectivity AMP Connectors	Enquête	-	-	SHILED FINGER 1210 EMBOSS PACKIN MOQ: 1 MPQ: 1	SHILED FINGER 1210 EMBOSS PACKIN	-	-	-	-	-	-	-	-
	97011417	Laird Technologies EMI	30	3 jours	-	CSTR,STR,SNB MOQ: 1 MPQ: 1	CSTR,STR,SNB	-	-	-	-	-	-	-	-

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