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Découvrez les produits 230
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
0C98050002
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
AP COIL BF USFT PSA
All-Purpose 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.600" (15.24mm) Unplated - Adhesive
98051502
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
NOSG,STR,BF,USF,PSA
Foldover 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.760" (19.30mm) - 299.21μin (7.60μm) Adhesive
SG100400TR-24.00
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
.100"H X .400"W 24"L--TRIANGLE--
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Triangle 0.100" (2.54mm) 0.400" (10.16mm) - - -
98055502
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
FINGERSTCK ULTRASFT 8.64X609.6MM
Twist 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.340" (8.64mm) - - -
3-20T-SN-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.20 SN 24--3-20T-SN-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.200" (5.08mm) Tin Flash Adhesive
3-S-23T-BD-24-NTP
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.23 BD 24 NTP--3-S-23T-B
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Unplated - Adhesive
3-23TV-SN-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.08 SN 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.080" (2.03mm) Tin Flash Adhesive
25-109FSDS-NI-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.25 X 1.09 NI 24--FOLDED SERIES
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 1.090" (27.69mm) Nickel Flash Adhesive
3-23T-NI-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.23 NI 24--3-23T-NI-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Nickel Flash Adhesive
3-S-23T-SN-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.23 SN 24--3-S-23T-SN-24
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Tin Flash Adhesive
3-S-23T-SN-24-NTP
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.23 SN 24 NTP--3-S-23T-S
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.230" (5.84mm) Tin Flash Adhesive
6-34T-BD-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.34 BD 24--6-34T-BD-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.340" (8.64mm) Unplated - Adhesive
6-34TV-BD-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.14 BD 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.070" (1.78mm) 0.140" (3.56mm) Unplated - Adhesive
3-23TV-NI-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.03 X 0.08 NI 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.030" (0.76mm) 0.080" (2.03mm) Nickel Flash Adhesive
0C98051502
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
NOSG COIL BF USF PSA
Foldover 121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 0.760" (19.30mm) Unplated - Adhesive
6-S-34T-BD-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.34 BD 24--6-S-34T-BD-24
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.340" (8.64mm) Unplated - Adhesive
6-S-34TV-BD-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.34 BD 24--TWIST RIGHT A
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.340" (8.64mm) Unplated - Adhesive
6-50T2-BD-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.06 X 0.50 BD 24--TWIST DOUBLE
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.500" (12.70mm) Unplated - Adhesive
6-30T-SN-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.30 SN 24--6-30T-SN-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.300" (7.62mm) Tin Flash Adhesive
6-30T-NI-24
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.07 X 0.30 NI 24--6-30T-NI-24--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.300" (7.62mm) Nickel Flash Adhesive