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- Operating Temperature：
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- Conditions sélectionnées:
Découvrez les produits 422
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
Enquête
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- |
-
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MOQ: 1 MPQ: 1
|
0.13 X 0.281 BD 16--13-28U-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.280" (7.11mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.37 NI 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.04 X 0.34 BD 16--4-34D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.040" (1.02mm) | 0.300" (7.62mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 045 BD 16--11-45C-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 050 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.45 X 060 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.44 X 070 BD 16--11-45C-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.10 X 0.30 X 070 SN 16--10-30C-
|
TechMESH | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.100" (2.54mm) | 0.300" (7.62mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.08 X 0.45 SN 16--8-45LPAH-SN-1
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 AG 16--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.370" (9.40mm) | Silver | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.05 X 0.38 BD 16--4-38D-BD-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.040" (1.02mm) | 0.380" (9.65mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.32 X 0.78 BD 16--32-78AH-BD-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.320" (8.13mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.45 CD SN 16--11-45CD-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.45 CT SN 16--11-45CT-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X 0.22 X 070 SN 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.060" (1.52mm) | 0.220" (5.59mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.77 SN 16--22-77RR-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.220" (5.59mm) | 0.770" (19.56mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 070 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 BD 16--25-109C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.07 X .25 X 045 BD 16--7-21C-04
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 0.250" (6.35mm) | Unplated | - | Adhesive |
