Découvrez les produits 26
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Series Operating Temperature Type Material Shape Length Width Plating Plating - Thickness Attachment Method
98054119
Laird Technologies EMI
Enquête
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MOQ: 1  MPQ: 1
NOSG,STR,NIB,USF,PSA
Foldover 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.380" (9.65mm) Nickel 299.21μin (7.60μm) Adhesive
12-60LPAH-BD-16
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.12 X 0.60 BD 16--12-60LPAH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.600" (15.24mm) Unplated - Adhesive
12-75RS-BD-16
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.12 X 0.75 BD 16--12-75RS-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.750" (19.05mm) Unplated - Adhesive
12-60LPAH-SN-16
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.12 X 0.60 SN 16--12-60LPAH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.600" (15.24mm) Tin Flash Adhesive
12-75RS-SN-16
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
0.12 X 0.75 SN 16--12-75RS-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.750" (19.05mm) Tin Flash Adhesive
SG120150D-24.00
Leader Tech Inc.
Enquête
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MOQ: 1  MPQ: 1
.120"H X .150"W X 24"L--D SHAPED
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 24.000" (609.60mm) 0.150" (3.81mm) - - -