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- Operating Temperature：
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- Material：
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- Shape：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 38
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
96
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 8.9X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.350" (8.90mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
10
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.335" (8.50mm) | - | - | Non-Conductive Adhesive | ||
|
|
TE Connectivity AMP Connectors |
20,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.177" (4.50mm) | 0.098" (2.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
16,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | - | Shield Finger | - | - | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | |||
|
|
TE Connectivity AMP Connectors |
16,671
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3525
|
- | - | Shield Finger | - | - | 0.177" (4.50mm) | 0.098" (2.50mm) | - | - | Solder | |||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
125
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
125
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Amphenol FCI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 3.5H TI CU G/F P
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.50MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU PTAFG PU V0 REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 12.000" (304.80mm) | 0.350" (8.90mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRS PU V0 REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 39.370" (100.00cm) | 0.350" (8.90mm) | - | - | - | ||
|
|
|
Amphenol FCI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRINT CONTACT GOLD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.197" (5.00mm) | 0.043" (1.10mm) | Gold | Flash | Solder |
