- Series：
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- Operating Temperature：
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- Length：
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- Plating：
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- Conditions sélectionnées:
Découvrez les produits 35
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Attachment Method | |
|
|
|
Leader Tech Inc. |
139
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FSG，.25"H X .375"W X 48"L
|
- | - | Fabric Over Foam | - | D-Shape | 48.000" (121.90cm) | 0.375" (9.52mm) | - | - | ||
|
|
|
Laird Technologies EMI |
405
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 24MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.375" (9.53mm) | 0.940" (23.88mm) | - | Hardware，Rivet，Solder | ||
|
|
|
Laird Technologies EMI |
97
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 27.69MMX406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | - | Hardware，Rivet，Solder | ||
|
|
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Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.81X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 1.090" (27.69mm) | - | Hardware，Rivet，Solder | ||
|
|
Leader Tech Inc. |
78
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | Tin | Adhesive | |||
|
|
Leader Tech Inc. |
53
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.550" (13.97mm) | - | Adhesive | |||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.60m) | 1.090" (27.69mm) | Unplated | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | Adhesive | ||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .375"W X 0.40"L--D SHAP
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.400" (10.16mm) | 0.375" (9.53mm) | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .600"W X 10"L--RECTANGU
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 10.000" (254.00mm) | 0.600" (15.24mm) | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .500"W X 8"L--RECTANGUL
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 8.000" (203.20mm) | 0.500" (12.70mm) | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 47.625 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .375"W X 24"L--D SHAPED
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"W X .250"H X 6.75"L--SQUARE
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | - | 6.750" (171.45mm) | 0.250" (6.35mm) | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"X.500"X.125" COMBO W/ ADH--
|
- | -75°C ~ 260°C | Gasket | - | Rectangular | - | 0.500" (12.70mm) | - | - | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 1.090" (27.69mm) | Unplated | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 85.875 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 7.16 (2.18m) | 0.780" (19.81mm) | Unplated | Adhesive |
