- Series：
-
- Operating Temperature：
-
- Shape：
-
- Plating - Thickness：
-
- Attachment Method：
-
- Conditions sélectionnées:
Découvrez les produits 22
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 19.81X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIE,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF PSA
|
All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,CDY,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNPB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
.250"H X .375"W X 24"L--D SHAPED
|
- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.375" (9.53mm) | - | - | - | |||
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 NI 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Nickel | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 BD 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 BD 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 SN 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 SN 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
|
|
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 SU 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive |
