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- Operating Temperature：
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- Length：
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- Plating：
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- Attachment Method：
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- Conditions sélectionnées:
Découvrez les produits 77
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Leader Tech Inc. |
4,150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
4,150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,333
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.118" (3.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
765
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 7.62X457.2MM DSHP
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 18.000" (457.20mm) | 0.299" (7.60mm) | - | - | Adhesive | ||
|
|
|
Wurth Electronics Inc. |
100
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | D-Shape | 39.370" (1.00m) | 0.276" (7.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Wurth Electronics Inc. |
10
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
WE-LT CONDUCTIVE SHIELDING GASKE
|
WE-LT | -40°C ~ 85°C | Fabric Over Foam | Polyurethane Foam，Rayon Paper | Rectangle | 39.370" (1.00m) | 0.236" (6.00mm) | - | - | Non-Conductive Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
D-SHAPE
|
- | - | Fabric Over Foam | - | D-Shape | 18.000" (457.20mm) | 0.299" (7.60mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT 1300/RL
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Tin | Flash | Solder | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Tin | Flash | Solder | ||
|
|
|
Harwin Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMT PRESSURE CONTACT TIN 1300
|
- | - | Shield Finger | - | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Tin | Flash | Solder | ||
|
|
|
Amphenol FCI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
2.50MM HEIGHT UNIVERSAL CONTACT
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.192" (4.87mm) | 0.039" (0.98mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 2.5H TI CU G/F P
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.192" (4.87mm) | 0.050" (1.28mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IO NICU NRS PU V0 REC
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangle | 0.720" (18.29mm) | 0.500" (12.70mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 REC
|
- | - | Fabric Over Foam | - | Rectangle | 1.180" (29.97mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 REC
|
- | - | Fabric Over Foam | - | Rectangle | 1.970" (50.04mm) | 0.500" (12.70mm) | - | - | Adhesive |
