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- Conditions sélectionnées:
Découvrez les produits 1,256
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Operating Temperature | Type | Material | Shape | Height | Length | Width | Plating | Plating - Thickness | ||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.067 X 0.177 SN 9.0--7-19PCI-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 9.000" (228.60mm) | 1.800" (45.72mm) | Tin | Flash | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 SN 16--3-23T-SN-16--
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Tin | Flash | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.23 BD 10.0--3-23T-BD-10
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 10.000" (254.00mm) | 0.230" (5.84mm) | Unplated | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 7.64--11-S-32AF-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 7.640" (194.06mm) | 0.320" (8.13mm) | Tin | Flash | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 1.291--11-S-32AF-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 1.291" (32.79mm) | 0.320" (8.13mm) | Tin | Flash | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 6.90--11-S-32AF-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 6.900" (175.26mm) | 0.320" (8.13mm) | Tin | Flash | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU NRSG PU V0 BELL
|
- | - | Fabric Over Foam | - | Bell | 0.091" (2.30mm) | 14.000" (355.60mm) | 0.315" (8.00mm) | - | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 47.625 NTP--FOLDE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.250" (6.35mm) | 3.97 (1.21m) | 0.780" (19.81mm) | Unplated | - | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.13 X 0.30 SN 0.356--13-30RH-SN
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.130" (3.30mm) | 0.356" (9.04mm) | 0.300" (7.62mm) | Tin | Flash | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.12 X 0.75 SN 16 NTP--12-75RS-S
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 16.000" (406.40mm) | 0.750" (19.05mm) | Tin | Flash | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.03 X 0.15 X 040 BD 16--TWIST C
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 16.000" (406.40mm) | 0.230" (5.84mm) | Unplated | - | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.230" (5.84mm) | 24.000" (609.60mm) | 0.600" (15.24mm) | Tin | 299.21μin (7.60μm) | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Tin | 299.21μin (7.60μm) | ||||
Leader Tech Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.11 X 0.32 SN 0.73--11-32RH-SN-
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.730" (18.54mm) | 0.320" (8.13mm) | Tin | Flash | ||||
Laird Technologies EMI |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Twist | 121°C | Fingerstock | Beryllium Copper | - | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.340" (8.64mm) | Nickel | 299.21μin (7.60μm) |