Series:
Voltage - Supply:
Frequency:
Memory Size:
Protocol:
Current - Receiving:
Modulation:
Current - Transmitting:
Découvrez les produits 2,307
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Series Voltage - Supply Operating Temperature Package / Case Mounting Type Frequency Memory Size Sensitivity Data Rate Power - Output Protocol Serial Interfaces Antenna Type Current - Receiving RF Family/Standard Modulation Current - Transmitting
WT11U-A-AI4
Silicon Labs
504
3 jours
-
MOQ: 1  MPQ: 1
CLASS 1 BLTOOTH 2.1+EDR MODULE
- - - - Module Surface Mount - - - - - - - - - - - -
SKY65266-11
Skyworks Solutions Inc.
15,000
3 jours
-
MOQ: 1  MPQ: 1
802.15 INTERA FRONT END MODULE Z
- - - - - - - - - - - - - - - - - -
AMW037
Silicon Labs
99
3 jours
-
MOQ: 1  MPQ: 1
WORLDS SMALLEST CERTIFIED B/G/N
Bulk - 3.3V -30°C ~ 85°C Module Surface Mount 2.4GHz 2MB Flash -93dBm 54Mbps 18dBm 802.11b/g/n SPI,UART - 50mA WiFi - 100mA ~ 200mA
HDG820P-BCQ3
H&D Wireless AB
80
3 jours
-
MOQ: 1  MPQ: 1
RF TXRX MODULE WIFI
Tray - 3 V ~ 3.6 V -40°C ~ 85°C Module Surface Mount 2.4GHz - - 72.2Mbps - 802.11b/g/n SPI,UART - - WiFi - -
SPB820P-BCQ1
H&D Wireless AB
40
3 jours
-
MOQ: 1  MPQ: 1
RF TXRX MOD WIFI CHIP + U.FL ANT
Bulk - 3 V ~ 3.6 V -40°C ~ 85°C Module Surface Mount 2.4GHz - - 72.2Mbps - 802.11b/g/n SPI,UART Integrated,Chip + U.FL - WiFi - -
LL-LTE-M-VZN-SE
Link Labs Inc.
Enquête
-
-
MOQ: 1  MPQ: 1
PRE-CERTIFIED LTE CAT-M1 MODEM F
Bulk - 3.1 V ~ 4.5 V -30°C ~ 60°C Module Through Hole 700MHz,1.7GHz - -103dBm 1Mbps 23dBm LTE UART - 330mA Cellular - 560mA
BGM12LBA9E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM13HBA9E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM13GBA9E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM15LBA12E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM15HBA12E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM17LBA15E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
BGM17HBA15E6327XTSA1
Infineon Technologies
Enquête
-
-
MOQ: 1  MPQ: 1
MULTI CHIP MODULES
- - - - - - - - - - - - - - - - - -
AMW007-1.2.0R
Silicon Labs
Enquête
-
-
MOQ: 1  MPQ: 1
WORLDS SMALLEST CERTIFIED B/G/N
- - - - - - - - - - - - - - - - - -
BGM123N256V2R
Silicon Labs
Enquête
-
-
MOQ: 1  MPQ: 1
MOD BLUETOOTH SIP BGM121
- - - - Module Surface Mount - - - - - - - - - - - -
BGM111E256V2R
Silicon Labs
Enquête
-
-
MOQ: 1  MPQ: 1
BLUETOOTH 4.X PCB MODULE,256KB
- - - - - - - - - - - - - - - - - -
CYBLE-212023-10
Cypress Semiconductor Corp
Enquête
-
-
MOQ: 1  MPQ: 1
RF TXRX MOD BLUETOOTH TRACE ANT
Tape & Reel (TR) EZ-BLE PRoC 1.8 V ~ 4.5 V -40°C ~ 85°C 31-SMD Module Surface Mount 2.4GHz 256kB Flash,32kB SRAM -91dBm 1Mbps 3dBm Bluetooth v4.1 I2C,SPI,UART Integrated,Trace 16.4mA Bluetooth - 15.6mA
CYBLE-212023-10
Cypress Semiconductor Corp
Enquête
-
-
MOQ: 1  MPQ: 1
RF TXRX MOD BLUETOOTH TRACE ANT
Cut Tape (CT) EZ-BLE PRoC 1.8 V ~ 4.5 V -40°C ~ 85°C 31-SMD Module Surface Mount 2.4GHz 256kB Flash,32kB SRAM -91dBm 1Mbps 3dBm Bluetooth v4.1 I2C,SPI,UART Integrated,Trace 16.4mA Bluetooth - 15.6mA
CYBLE-212023-10
Cypress Semiconductor Corp
Enquête
-
-
MOQ: 1  MPQ: 1
RF TXRX MOD BLUETOOTH TRACE ANT
- EZ-BLE PRoC 1.8 V ~ 4.5 V -40°C ~ 85°C 31-SMD Module Surface Mount 2.4GHz 256kB Flash,32kB SRAM -91dBm 1Mbps 3dBm Bluetooth v4.1 I2C,SPI,UART Integrated,Trace 16.4mA Bluetooth - 15.6mA
AMS002-3.0.0R
Silicon Labs
Enquête
-
-
MOQ: 1  MPQ: 1
ZENTRI MODULE,BLUETOOTH LOW ENE
- - 1.8 V ~ 3.6 V -30°C ~ 85°C - Surface Mount 2.4GHz 8MB Flash -94dBm 1Mbps 4dBm Bluetooth v4.1 I2C,SPI,USART Integrated,Trace 26.6mA Bluetooth DSSS,GFSK 22mA