Émetteur-récepteur RF Ics - Zui Ai Technology（Taiwan）Company.

Packaging：

Voltage - Supply：

Operating Temperature：

Package / Case：

Type：

Frequency：

Memory Size：

Sensitivity：

Power - Output：

Protocol：

Data Rate (Max)：

Serial Interfaces：

Current - Receiving：

RF Family/Standard：

Modulation：

GPIO：

Current - Transmitting：

Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Voltage - Supply	Operating Temperature	Package / Case	Type	Frequency	Memory Size	Sensitivity	Power - Output	Protocol	Data Rate (Max)	Serial Interfaces	Current - Receiving	RF Family/Standard	Modulation	GPIO	Current - Transmitting
Image	Numéro de pièce	Fabricant	Quantité	Délai de livraison	Prix unitaire	Acheter	Description	Packaging	Voltage - Supply	Operating Temperature	Package / Case	Type	Frequency	Memory Size	Sensitivity	Power - Output	Protocol	Data Rate (Max)	Serial Interfaces	Current - Receiving	RF Family/Standard	Modulation	GPIO	Current - Transmitting
	TJM35420XLQ,EL	Toshiba Semiconductor and Storage	Enquête	-	-	TRANSFERJET WIRELESS TRANSCEIVER MOQ: 1 MPQ: 1	TRANSFERJET WIRELESS TRANSCEIVER	-	-	-	Module	-	-	-	-	-	-	-	-	-	-	-	-	-
	TC35662IXBG(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	COMBO WIRELESS CHIP SUPPORTING W MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING W	Tape & Reel (TR)	3.3V	-40°C ~ 85°C	-	TxRx + MCU	2.4GHz	-	-95dBm	18dBm	802.11a/b/g/n，Bluetooth v4.2	150Mbps	I2C，I2S，SPI，UART，USB	-	Bluetooth，WiFi	-	-	-
	TC35662IXBG(EL)	Toshiba Semiconductor and Storage	999	3 jours	-	COMBO WIRELESS CHIP SUPPORTING W MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING W	Cut Tape (CT)	3.3V	-40°C ~ 85°C	-	TxRx + MCU	2.4GHz	-	-95dBm	18dBm	802.11a/b/g/n，Bluetooth v4.2	150Mbps	I2C，I2S，SPI，UART，USB	-	Bluetooth，WiFi	-	-	-
	TC35662IXBG(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	COMBO WIRELESS CHIP SUPPORTING W MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING W	-	3.3V	-40°C ~ 85°C	-	TxRx + MCU	2.4GHz	-	-95dBm	18dBm	802.11a/b/g/n，Bluetooth v4.2	150Mbps	I2C，I2S，SPI，UART，USB	-	Bluetooth，WiFi	-	-	-
	TC32306FTG,EL	Toshiba Semiconductor and Storage	Enquête	-	-	IC RF TXRX ISM MOQ: 1 MPQ: 1	IC RF TXRX ISM	Tape & Reel (TR)	2 V ~ 3.3 V，2.4 V ~ 5.5 V	-40°C ~ 110°C	36-VFQFN Exposed Pad	TxRx Only	315MHz，434MHz，868MHz，915MHz	-	-121dBm	10dBm	-	-	SPI	9.2mA ~ 11.1mA	General ISM < 1GHz	ASK，FSK	-	4.8mA ~ 12mA
	TC32306FTG,EL	Toshiba Semiconductor and Storage	Enquête	-	-	IC RF TXRX ISM MOQ: 1 MPQ: 1	IC RF TXRX ISM	Cut Tape (CT)	2 V ~ 3.3 V，2.4 V ~ 5.5 V	-40°C ~ 110°C	36-VFQFN Exposed Pad	TxRx Only	315MHz，434MHz，868MHz，915MHz	-	-121dBm	10dBm	-	-	SPI	9.2mA ~ 11.1mA	General ISM < 1GHz	ASK，FSK	-	4.8mA ~ 12mA
	TC32306FTG,EL	Toshiba Semiconductor and Storage	Enquête	-	-	IC RF TXRX ISM MOQ: 1 MPQ: 1	IC RF TXRX ISM	-	2 V ~ 3.3 V，2.4 V ~ 5.5 V	-40°C ~ 110°C	36-VFQFN Exposed Pad	TxRx Only	315MHz，434MHz，868MHz，915MHz	-	-121dBm	10dBm	-	-	SPI	9.2mA ~ 11.1mA	General ISM < 1GHz	ASK，FSK	-	4.8mA ~ 12mA
	TC35679FSG-002	Toshiba Semiconductor and Storage	Enquête	-	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	Tape & Reel (TR)	1.8 V ~ 3.6 V	-40°C ~ 85°C	60-VFQFN Exposed Pad	TxRx + MCU	2.4GHz	-	-93dBm	0dBm	Bluetooth v4.2	-	I2C，SPI，UART	3.3mA	Bluetooth	-	-	3.3mA
	TC35675XBG-001(EL)	Toshiba Semiconductor and Storage	2,000	3 jours	-	COMBO WIRELESS CHIP SUPPORTING B MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING B	Tape & Reel (TR)	-	-	52-TFBGA	-	-	-	-	-	-	-	-	-	-	-	-	-
	TC35675XBG-001(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	COMBO WIRELESS CHIP SUPPORTING B MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING B	Cut Tape (CT)	-	-	52-TFBGA	-	-	-	-	-	-	-	-	-	-	-	-	-
	TC35675XBG-001(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	COMBO WIRELESS CHIP SUPPORTING B MOQ: 1 MPQ: 1	COMBO WIRELESS CHIP SUPPORTING B	-	-	-	52-TFBGA	-	-	-	-	-	-	-	-	-	-	-	-	-
	TC35678FXG-002(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	Tape & Reel (TR)	2 V ~ 3.6 V	-40°C ~ 85°C	60-VFQFN Exposed Pad	TxRx + MCU	2.4GHz	256kB Flash，384kB ROM，192kB RAM	-94dBm	0dBm	Bluetooth v4.2	-	I2C，SPI	3.3mA	Bluetooth	GFSK	17	3.3mA
	TC35678FXG-002(EL)	Toshiba Semiconductor and Storage	1,985	3 jours	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	Cut Tape (CT)	2 V ~ 3.6 V	-40°C ~ 85°C	60-VFQFN Exposed Pad	TxRx + MCU	2.4GHz	256kB Flash，384kB ROM，192kB RAM	-94dBm	0dBm	Bluetooth v4.2	-	I2C，SPI	3.3mA	Bluetooth	GFSK	17	3.3mA
	TC35678FXG-002(EL)	Toshiba Semiconductor and Storage	Enquête	-	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	-	2 V ~ 3.6 V	-40°C ~ 85°C	60-VFQFN Exposed Pad	TxRx + MCU	2.4GHz	256kB Flash，384kB ROM，192kB RAM	-94dBm	0dBm	Bluetooth v4.2	-	I2C，SPI	3.3mA	Bluetooth	GFSK	17	3.3mA
	TC35678FSG-002	Toshiba Semiconductor and Storage	Enquête	-	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	Tape & Reel (TR)	2 V ~ 3.6 V	-40°C ~ 85°C	60-VFQFN Exposed Pad	TxRx + MCU	2.4GHz	256kB Flash，384kB ROM，192kB RAM	-93dBm	0dBm	Bluetooth v4.2	-	I2C，SPI	3.3mA	Bluetooth	GFSK	17	3.3mA
	TC35678FXG-002,EL	Toshiba Semiconductor and Storage	Enquête	-	-	V4.2 BLUETOOTH SMART IC IMPLEMEN MOQ: 1 MPQ: 1	V4.2 BLUETOOTH SMART IC IMPLEMEN	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-

Envoyé avec succès!