- Packaging：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Sensitivity：
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- Conditions sélectionnées:
Découvrez les produits 15
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | |
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 42-CSP
|
Tape & Reel (TR) | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 42-CSP | 4MB ROM | -85.5dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
1,990
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 42-CSP
|
Cut Tape (CT) | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 42-CSP | 4MB ROM | -85.5dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
1,990
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 42-CSP
|
- | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 42-CSP | 4MB ROM | -85.5dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUTOOTH 120VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 120-VFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.1，v1.2，Class 1，2 and 3 | |||
|
|
Qualcomm |
1,456
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUTOOTH 120VFBGA
|
Cut Tape (CT) | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 120-VFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.1，v1.2，Class 1，2 and 3 | |||
|
|
Qualcomm |
1,456
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUTOOTH 120VFBGA
|
- | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 120-VFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.1，v1.2，Class 1，2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96LFBGA
|
Tape & Reel (TR) | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 96-LFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96LFBGA
|
Cut Tape (CT) | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 96-LFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
64
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96LFBGA
|
- | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 96-LFBGA | 8MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 84VFBGA
|
Tape & Reel (TR) | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 84-VFBGA | 4MB ROM，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 84VFBGA
|
Cut Tape (CT) | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 84-VFBGA | 4MB ROM，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 84VFBGA
|
- | 1.8 V ~ 3.6 V | -40°C ~ 150°C | 84-VFBGA | 4MB ROM，32kB RAM | -85dBm | 4dBm | Bluetooth v1.2，Class 2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96TFBGA
|
Tape & Reel (TR) | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 96-TFBGA | 6MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.1，v1.2，Class 1，2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96TFBGA
|
Cut Tape (CT) | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 96-TFBGA | 6MB Flash，32kB RAM | -85dBm | 4dBm | Bluetooth v1.1，v1.2，Class 1，2 and 3 | |||
|
|
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 96VFBGA
|
Tape & Reel (TR) | 1.7 V ~ 3.6 V | -40°C ~ 105°C | 96-VFBGA | - | -85dBm | 6dBm | Bluetooth v1.2，Class 2 and 3 |
