- Packaging：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Sensitivity：
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- Power - Output：
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- Protocol：
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- Serial Interfaces：
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- RF Family/Standard：
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- Conditions sélectionnées:
Découvrez les produits 14
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Sensitivity | Power - Output | Protocol | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
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Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD，DUAL CORE MCU
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
4,994
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD，DUAL CORE MCU
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
4,994
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD，DUAL CORE MCU
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6，DUAL CORE M
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
2,989
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6，DUAL CORE M
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
2,989
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6，DUAL CORE M
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | - | 34 | 240mA | ||
|
|
|
Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD，DUAL CORE MCU
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | CCK，DSSS，OFDM | 34 | 240mA | ||
|
|
|
Espressif Systems |
4,900
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD，DUAL CORE MCU
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | CCK，DSSS，OFDM | 34 | 240mA | ||
|
|
|
Espressif Systems |
4,900
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD，DUAL CORE MCU
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | -98dBm | 20dBm | 802.11b/g/n，Bluetooth 4.2 | I2C，I2S，SPI，UART | 100mA | Bluetooth，WiFi | CCK，DSSS，OFDM | 34 | 240mA | ||
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|
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Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING W
|
Tape & Reel (TR) | 3.3V | -40°C ~ 85°C | - | -95dBm | 18dBm | 802.11a/b/g/n，Bluetooth v4.2 | I2C，I2S，SPI，UART，USB | - | Bluetooth，WiFi | - | - | - | ||
|
|
|
Toshiba Semiconductor and Storage |
999
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING W
|
Cut Tape (CT) | 3.3V | -40°C ~ 85°C | - | -95dBm | 18dBm | 802.11a/b/g/n，Bluetooth v4.2 | I2C，I2S，SPI，UART，USB | - | Bluetooth，WiFi | - | - | - | ||
|
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
COMBO WIRELESS CHIP SUPPORTING W
|
- | 3.3V | -40°C ~ 85°C | - | -95dBm | 18dBm | 802.11a/b/g/n，Bluetooth v4.2 | I2C，I2S，SPI，UART，USB | - | Bluetooth，WiFi | - | - | - | ||
|
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Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLE/WIFI 316WLCSP
|
Tape & Reel (TR) | 1.2 V ~ 3.3 V | -30°C ~ 85°C | 316-XFBGA，WLCSP | -98dBm | 20.5dBm | 802.11a/b/g/n | I2C，I2S，JTAG，SPI，UART | - | WiFi | 16QAM，64QAM，BPSK，CCK，DSSS，OFDM，QPSK | 17 | - | |||
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Cypress Semiconductor Corp |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLE/WIFI 151WLBGA
|
Tape & Reel (TR) | 1.2 V ~ 3.6 V | -30°C ~ 85°C | 151-UFBGA，WLBGA | -98dBm | 20.5dBm | 802.11b/g/n | I2C，SPI，UART | - | WiFi | 16QAM，64QAM，BPSK，CCK，DSSS，OFDM，QPSK | 17 | - |
