- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Memory Size：
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- Sensitivity：
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- Serial Interfaces：
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- Conditions sélectionnées:
Découvrez les produits 17
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | |
|
|
|
Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | I2C，I2S，PCM，SPI，UART，USB | - | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOWPWR SMART SOC QFN40
|
- | - | 3.3V | -40°C ~ 85°C | - | 32kB OTP，84kB ROM，50kB SRAM | -93dBm | I2C，SPI，UART | 3.7mA | - | 32 | 3.4mA | ||
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|
|
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOW ENERGY SOC QFN56
|
- | - | 1.8V | -20°C ~ 60°C | - | 32kB OTP，84kB ROM，50kB SRAM | -93dBm | I2C，SPI，UART | 3.7mA | - | 29 | 3.4mA | ||
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|
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Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | - | -93dBm | I2C，SPI，UART | 3.3mA | - | - | 3.3mA | ||
|
|
|
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOWPWR SMART SOC QFN48
|
- | - | 3.3V | -40°C ~ 85°C | - | 32kB OTP，84kB ROM，50kB SRAM | -93dBm | I2C，SPI，UART | 3.7mA | - | 32 | 3.4mA | ||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | I2C，SPI | 3.3mA | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
1,985
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Cut Tape (CT) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | I2C，SPI | 3.3mA | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
- | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | I2C，SPI | 3.3mA | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -93dBm | I2C，SPI | 3.3mA | GFSK | 17 | 3.3mA |
