- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Memory Size：
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- Sensitivity：
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- Serial Interfaces：
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- Current - Receiving：
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- Modulation：
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- Current - Transmitting：
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- Conditions sélectionnées:
Découvrez les produits 20
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Data Rate (Max) | Serial Interfaces | Current - Receiving | Modulation | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Data Rate (Max) | Serial Interfaces | Current - Receiving | Modulation | Current - Transmitting | |
|
|
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Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
5,553
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
6,285
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 60AQFN
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 60-VFQFN | 8Mb Flash，64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Texas Instruments |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
Tape & Reel (TR) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows，Exposed Pad | - | -95dBm | 12dBm | - | UART | - | 4DQPSK，8DPSK，GFSK | 112.5mA | ||
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|
|
Texas Instruments |
425
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
Cut Tape (CT) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows，Exposed Pad | - | -95dBm | 12dBm | - | UART | - | 4DQPSK，8DPSK，GFSK | 112.5mA | ||
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|
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Texas Instruments |
425
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
DUAL-MODE BLUETOOTH CONTROLLER
|
- | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows，Exposed Pad | - | -95dBm | 12dBm | - | UART | - | 4DQPSK，8DPSK，GFSK | 112.5mA | ||
|
|
|
NXP USA Inc. |
2,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 512kB Flash，128kB RAM | -102dBm | 4dBm | - | I2C，SPI，UART | 6.2mA | - | 6mA | ||
|
|
|
NXP USA Inc. |
1,214
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 512kB Flash，128kB RAM | -102dBm | 4dBm | - | I2C，SPI，UART | 6.2mA | - | 6mA | ||
|
|
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Texas Instruments |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
ORCA REV C
|
Tape & Reel (TR) | - | 1.7 V ~ 4.8 V | -40°C ~ 85°C | 76-VQFN Dual Rows，Exposed Pad | - | -96dBm | 10dBm | - | UART | - | 8DPSK，DQPSK，GFSK | 112.5mA | ||
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|
|
Dialog Semiconductor GmbH |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Tape & Reel (TR) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
Cut Tape (CT) | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
Dialog Semiconductor GmbH |
7,718
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RX TXRX+MCU BLUETOOTH 53WLCSP
|
- | SmartBond | 1.7 V ~ 4.5 V | - | 53-BGA，WLCSP | 64kB OTP，128kB ROM，144kB SRAM | -94dBm | 0dBm | - | I2C，I2S，PCM，SPI，UART，USB | - | - | - | ||
|
|
|
NXP USA Inc. |
177
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
KINETIS L 32-BIT MCU ARM CORTEX-
|
Tray | - | 1.71 V ~ 3.6 V | - | 48-VFQFN | 256kB Flash，64kB RAM | -102dBm | 4dBm | - | I2C，SPI，UART | 6.2mA | - | 6mA | ||
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|
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Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | - | -93dBm | 0dBm | - | I2C，SPI，UART | 3.3mA | - | 3.3mA | ||
|
|
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Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IOT BLUETOOTH 802.15.4 49FCBGA
|
- | - | 3.3V | -30°C ~ 85°C | - | - | -96dBm | 12dBm | 3Mbps | I2C，SPI，UART，USB | 12.5mA | 4DQPSK，8DPSK，GFSK | 26.5mA | ||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 76WLCSP
|
Tape & Reel (TR) | PRoC | 1.9 V ~ 5.5 V | -40°C ~ 105°C | 76-XFBGA，WLCSP | 256kB Flash，32kB SRAM | -91dBm | 3dBm | 1Mbps | I2C，I2S，SPI，UART | 16.4mA | GFSK | 15.6mA | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 60QFN
|
Tray | - | 3.3V | -30°C ~ 85°C | 60-VFQFN Exposed Pad | - | -94.5dBm | 10dBm | 2Mbps | I2C，I2S，SPI，UART | 8mA | GFSK | 18mA |
