- Packaging：
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- Series：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Memory Size：
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- Sensitivity：
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- Protocol：
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- Data Rate (Max)：
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- Current - Receiving：
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- RF Family/Standard：
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- Modulation：
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- Current - Transmitting：
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- Conditions sélectionnées:
Découvrez les produits 16
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Data Rate (Max) | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Data Rate (Max) | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | |
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NXP USA Inc. |
2,643
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tray | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 60kB Flash，4kB RAM | -92dBm | 3dBm | ZigBee? | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
|
NXP USA Inc. |
495
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tray | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 16kB Flash，1kB RAM | -92dBm | 3dBm | - | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
|
NXP USA Inc. |
8,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tape & Reel (TR) | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 60kB Flash，4kB RAM | -92dBm | 3dBm | ZigBee? | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
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Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU ISM>1GHZ 48-VFQFN
|
Tray | WirelessUSB | 2.7 V ~ 3.6 V | 0°C ~ 70°C | 48-VFQFN Exposed Pad | 8kB Flash，512B SRAM | -95dBm | 0dBm | - | 62.5kbps | 61.3mA | General ISM > 1GHZ | DSSS | 18 | 74.7mA | ||
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|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tape & Reel (TR) | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 16kB Flash，1kB RAM | -92dBm | 3dBm | - | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tape & Reel (TR) | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 32kB Flash，2kB RAM | -92dBm | 3dBm | - | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-VFLGA
|
Tray | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-VFLGA Exposed Pad | 32kB Flash，2kB RAM | -92dBm | 3dBm | - | 250kbps | 37mA | 802.15.4 | DSSS，O-QPSK | 32 | 30mA | ||
|
|
Cypress Semiconductor Corp |
574
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU ISM>1GHZ 40-VFQFN
|
Tray | PRoC | 1.9 V ~ 3.6 V | 0°C ~ 70°C | 40-VFQFN Exposed Pad | 32kB Flash，2kB SRAM | -87dBm | 1dBm | - | 1Mbps | 18mA | General ISM > 1GHZ | FHSS，GFSK | 13 | 13.7mA ~ 18.5mA | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU ISM>1GHZ 68-VFQFN
|
Tray | PRoC | 1.9 V ~ 3.6 V | 0°C ~ 70°C | 68-VFQFN Exposed Pad | 32kB Flash，2kB SRAM | -87dBm | 1dBm | - | 1Mbps | 18mA | General ISM > 1GHZ | GFSK | 35 | 13.7mA ~ 18.5mA | |||
|
|
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU ISM>1GHZ 68-VFQFN
|
Tray | PRoC | 1.9 V ~ 3.6 V | 0°C ~ 70°C | 68-VFQFN Exposed Pad | 32kB Flash，2kB SRAM | -87dBm | 1dBm | - | 1Mbps | 18mA | General ISM > 1GHZ | FHSS，GFSK | 35 | 13.7mA ~ 18.5mA | |||
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|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-LGA
|
Tray | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-LGA | 60kB Flash，4kB RAM | -92dBm | 0dBm | ZigBee? | 250kbps | 37mA | 802.15.4 | O-QPSK | 38 | 30mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 71-LGA
|
Tape & Reel (TR) | - | 2 V ~ 3.4 V | -40°C ~ 85°C | 71-LGA | 60kB Flash，4kB RAM | -92dBm | 0dBm | ZigBee? | 250kbps | 37mA | 802.15.4 | O-QPSK | 38 | 30mA | ||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | - | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
1,985
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Cut Tape (CT) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | - | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
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Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
- | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -94dBm | 0dBm | Bluetooth v4.2 | - | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA | |||
|
|
Toshiba Semiconductor and Storage |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
V4.2 BLUETOOTH SMART IC IMPLEMEN
|
Tape & Reel (TR) | - | 2 V ~ 3.6 V | -40°C ~ 85°C | 60-VFQFN Exposed Pad | 256kB Flash，384kB ROM，192kB RAM | -93dBm | 0dBm | Bluetooth v4.2 | - | 3.3mA | Bluetooth | GFSK | 17 | 3.3mA |
