- Packaging:
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- Voltage - Supply:
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- Package / Case:
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- Memory Size:
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- Sensitivity:
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- Protocol:
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- Data Rate (Max):
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- Serial Interfaces:
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- Current - Receiving:
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- RF Family/Standard:
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- Modulation:
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- Current - Transmitting:
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- Conditions sélectionnées:
Découvrez les produits 12
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Package / Case | Memory Size | Sensitivity | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Package / Case | Memory Size | Sensitivity | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | GPIO | Current - Transmitting | ||
Inventek Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOW ENERGY
|
Tape & Reel (TR) | 1.62 V ~ 3.63 V | 48-SMD Module | - | -94dBm | Bluetooth v4.0 | 1Mbps | I2C,SPI,UART | - | Bluetooth | - | 19 | - | ||||
Inventek Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOW ENERGY
|
Cut Tape (CT) | 1.62 V ~ 3.63 V | 48-SMD Module | - | -94dBm | Bluetooth v4.0 | 1Mbps | I2C,SPI,UART | - | Bluetooth | - | 19 | - | ||||
Inventek Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BLUETOOTH LOW ENERGY
|
- | 1.62 V ~ 3.63 V | 48-SMD Module | - | -94dBm | Bluetooth v4.0 | 1Mbps | I2C,SPI,UART | - | Bluetooth | - | 19 | - | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFLGA
|
Tray | 1.8 V ~ 3.6 V | 48-VFLGA,CSP | 128kB Flash,8kB RAM | -93dBm | - | 250kbps | I2C,SPI,UART | 22.3mA ~ 34.2mA | 802.15.4 | O-QPSK | 32 | 26.6mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFLGA
|
Tray | 1.8 V ~ 3.6 V | 48-VFLGA | 128kB Flash,8kB RAM | -93dBm | - | 250kbps | I2C,SPI,UART | 22.3mA ~ 34.2mA | 802.15.4 | O-QPSK | 28 | 26.6mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | 1.8 V ~ 3.6 V | 48-VFQFN Exposed Pad | 82kB Flash,5kB RAM | -94dBm | ZigBee? | 250kbps | I2C,SPI,UART | 22.3mA ~ 34.2mA | 802.15.4 | O-QPSK | 32 | 26.6mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | 1.8 V ~ 3.6 V | 48-VFQFN Exposed Pad | 82kB Flash,5kB RAM | -94dBm | ZigBee? | 250kbps | I2C,SPI,UART | 22.3mA ~ 34.2mA | 802.15.4 | O-QPSK | 32 | 26.6mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
Tape & Reel (TR) | 1.62 V ~ 3.6 V | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 35 | 3.5mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
Cut Tape (CT) | 1.62 V ~ 3.6 V | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 35 | 3.5mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
- | 1.62 V ~ 3.6 V | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 35 | 3.5mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
- | 1.62 V ~ 3.6 V | - | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | - | 3.5mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
RF SYSTEM ON A CHIP
|
- | 1.62 V ~ 3.6 V | - | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | - | 3.5mA |