- Packaging：
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- Operating Temperature：
-
- Package / Case：
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- Modulation：
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- Conditions sélectionnées:
Découvrez les produits 23
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Modulation | GPIO | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Modulation | GPIO | |
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
3,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | -40°C ~ 85°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
3,026
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | -40°C ~ 85°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 48-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
3,955
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | -40°C ~ 125°C | 48-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | -40°C ~ 125°C | 48-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tape & Reel (TR) | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Cut Tape (CT) | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
- | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | -40°C ~ 125°C | 48-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | -40°C ~ 125°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | -40°C ~ 125°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | -40°C ~ 125°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | -40°C ~ 125°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | -40°C ~ 85°C | 48-VFQFN Exposed Pad | O-QPSK | 32 | |||
|
|
Microchip Technology |
10
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tray | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
3,936
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Cut Tape (CT) | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
1,697
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tray | -40°C ~ 85°C | 64-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
1,281
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tray | -40°C ~ 125°C | 48-VFQFN Exposed Pad | DSSS，O-QPSK | 35 | |||
|
|
Microchip Technology |
2,607
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | -40°C ~ 125°C | 48-VFQFN Exposed Pad | O-QPSK | 32 |
