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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Memory Size:
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- Sensitivity:
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- Power - Output:
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- Data Rate (Max):
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- Serial Interfaces:
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- Current - Receiving:
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- RF Family/Standard:
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- Modulation:
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- Current - Transmitting:
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- Conditions sélectionnées:
Découvrez les produits 42
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | Current - Transmitting | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Sensitivity | Power - Output | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | RF Family/Standard | Modulation | Current - Transmitting | ||
Qualcomm |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 56-QFN
|
Tape & Reel (TR) | μEnergy | 1.2 V ~ 3.6 V | -30°C ~ 85°C | 56-QFN | 64kB RAM,64kB ROM | -92.5dBm | 7.5dBm | Bluetooth v4.0 | 2MBaud | I2C,SPI,UART | 16mA | Bluetooth | - | 16mA | ||||
Microchip Technology |
2,829
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tray | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tray | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 128kB Flash,4kB EEPROM,16kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 128kB Flash,4kB EEPROM,16kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Cut Tape (CT) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 128kB Flash,4kB EEPROM,16kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
4,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
- | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 128kB Flash,4kB EEPROM,16kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Qualcomm |
1,892
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 56-QFN
|
Cut Tape (CT) | μEnergy | 1.2 V ~ 3.6 V | -30°C ~ 85°C | 56-QFN | 64kB RAM,64kB ROM | -92.5dBm | 7.5dBm | Bluetooth v4.0 | 2MBaud | I2C,SPI,UART | 16mA | Bluetooth | - | 16mA | ||||
Qualcomm |
1,892
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH 56-QFN
|
- | μEnergy | 1.2 V ~ 3.6 V | -30°C ~ 85°C | 56-QFN | 64kB RAM,64kB ROM | -92.5dBm | 7.5dBm | Bluetooth v4.0 | 2MBaud | I2C,SPI,UART | 16mA | Bluetooth | - | 16mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
Tape & Reel (TR) | - | 1.62 V ~ 3.6 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | 2dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 3.5mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
Cut Tape (CT) | - | 1.62 V ~ 3.6 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | 2dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 3.5mA | ||||
NXP USA Inc. |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
BTLE SOC
|
- | - | 1.62 V ~ 3.6 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 512kB Flash,256kB ROM,128kB SRAM | -95dBm | 2dBm | Bluetooth v5.0 | - | I2C,SPI,UART,USART,USB | 3.5mA | Bluetooth | - | 3.5mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
3,622
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Cut Tape (CT) | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
3,622
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
- | - | 1.8 V ~ 3.6 V | -40°C ~ 85°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
2,800
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
Cut Tape (CT) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 64-VFQFN
|
- | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 64-VFQFN Exposed Pad | 256kB Flash,8kB EEPROM,32kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Tape & Reel (TR) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | 64kB Flash,2kB EEPROM,8kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
3,955
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
Cut Tape (CT) | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | 64kB Flash,2kB EEPROM,8kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU 802.15.4 48-VFQFN
|
- | - | 1.8 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | 64kB Flash,2kB EEPROM,8kB SRAM | -100dBm | 3.5dBm | ZigBee? | 2Mbps | I2C,JTAG,SPI,USART | 5mA ~ 12.5mA | 802.15.4 | DSSS,O-QPSK | 8mA ~ 14.5mA |