- Packaging:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Memory Size:
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- Power - Output:
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- Protocol:
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- Data Rate (Max):
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- Serial Interfaces:
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- Current - Receiving:
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- Modulation:
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- Current - Transmitting:
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- Conditions sélectionnées:
Découvrez les produits 16
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Power - Output | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Memory Size | Power - Output | Protocol | Data Rate (Max) | Serial Interfaces | Current - Receiving | Modulation | GPIO | Current - Transmitting | ||
Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD,DUAL CORE MCU
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
4,994
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD,DUAL CORE MCU
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
4,994
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WD,DUAL CORE MCU
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6,DUAL CORE M
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
2,989
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6,DUAL CORE M
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
2,989
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D0WDQ6,DUAL CORE M
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | - | 34 | 240mA | ||||
Espressif Systems |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD,DUAL CORE MCU
|
Tape & Reel (TR) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | CCK,DSSS,OFDM | 34 | 240mA | ||||
Espressif Systems |
4,900
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD,DUAL CORE MCU
|
Cut Tape (CT) | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | CCK,DSSS,OFDM | 34 | 240mA | ||||
Espressif Systems |
4,900
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SMD IC ESP32-D2WD,DUAL CORE MCU
|
- | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 48-VFQFN Exposed Pad | - | 20dBm | 802.11b/g/n,Bluetooth 4.2 | 150Mbps | I2C,I2S,SPI,UART | 100mA | CCK,DSSS,OFDM | 34 | 240mA | ||||
Microchip Technology |
219
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH/WIFI
|
Tray | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 256kB ROM,708kB RAM | 20dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 83.7mA ~ 91.8mA | 8PSK,GFSK,QPSK | 18 | 276mA ~ 325mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SOC RF LINK CTLR/BT 4.0 48QFN
|
Tray | 3.6V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | 19dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 92mA | 8PSK,GFSK,QPSK | 18 | 325mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SOC RF LINK CTLR/BT 4.0 48QFN
|
Tape & Reel (TR) | 3.6V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | 19dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 92mA | 8PSK,GFSK,QPSK | 18 | 325mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SOC RF LINK CTLR/BT 4.0 48QFN
|
Cut Tape (CT) | 3.6V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | 19dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 92mA | 8PSK,GFSK,QPSK | 18 | 325mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SOC RF LINK CTLR/BT 4.0 48QFN
|
- | 3.6V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | - | 19dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 92mA | 8PSK,GFSK,QPSK | 18 | 325mA | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLUETOOTH/WIFI
|
Tape & Reel (TR) | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 48-VFQFN Exposed Pad | 256kB ROM,708kB RAM | 20dBm | 802.11b/g/n,Bluetooth v4.0 | 72.2Mbps | I2C,SDIO,SPI,UART | 83.7mA ~ 91.8mA | 8PSK,GFSK,QPSK | 18 | 276mA ~ 325mA | ||||
Cypress Semiconductor Corp |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC RF TXRX+MCU BLE/WIFI 145WLBGA
|
Tape & Reel (TR) | 1.2 V ~ 3.3 V | -40°C ~ 85°C | 145-UFBGA,WLBGA | - | 13dBm | 802.11a/b/g/n,Bluetooth v4.1 | - | I2S,SPI,UART | - | 8DPSK,DQPSK,GFSK | 9 | - |