- Fabricant:
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- Packaging:
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Découvrez les produits 330
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Package / Case | Supplier Device Package | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Package / Case | Supplier Device Package | Type | ||
FTDI,Future Technology Devices International Ltd |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC USB FIFO 32LQFP
|
Tape & Reel (TR) | - | 32-LQFP | 32-LQFP (7x7) | USB FIFO | ||||
FTDI,Future Technology Devices International Ltd |
1,205
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB FIFO 32LQFP
|
Cut Tape (CT) | - | 32-LQFP | 32-LQFP (7x7) | USB FIFO | ||||
FTDI,Future Technology Devices International Ltd |
1,205
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB FIFO 32LQFP
|
- | - | 32-LQFP | 32-LQFP (7x7) | USB FIFO | ||||
FTDI,Future Technology Devices International Ltd |
743
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB FIFO 32LQFP
|
Tray | - | 32-LQFP | 32-LQFP (7x7) | USB FIFO | ||||
Amulet Technologies LLC |
1,113
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC GUI PROCESSOR 208PQFP
|
Tray | - | 208-BFQFP | 208-PQFP (28x28) | GUI Processor | ||||
Texas Instruments |
26
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DIG MICROMIRROR DEVICE 516BGA
|
Tube | - | 516-BGA | 516-BGA (27x27) | Digital Micromirror Device (DMD) | ||||
Texas Instruments |
54
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CONFIGURATION PROM 48DSBGA
|
Tray | - | 48-TFBGA,DSBGA | 48-DSBGA (8x9) | Configuration PROM | ||||
Amulet Technologies LLC |
721
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MICROCONTROLLER 80PQFP
|
Tray | - | 80-BQFP | 80-PQFP (14x20) | Microcontroller | ||||
Power Integrations |
5,000
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC AUTOMATIC DISCHARGE 8SO
|
Tape & Reel (TR) | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | Automatic Discharge | ||||
Power Integrations |
2,004
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC AUTOMATIC DISCHARGE 8SO
|
Tube | - | 8-SOIC (0.154",3.90mm Width) | 8-SO | Automatic Discharge | ||||
Infineon Technologies |
1,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC LOW-SIDE SWITCH DSO36-72
|
Tape & Reel (TR) | Automotive,AEC-Q100 | 36-BFSOP (0.295",7.50mm Width) Exposed Pad | PG-DSO-36-72 | Low-Side Switch | ||||
Infineon Technologies |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOW-SIDE SWITCH DSO36-72
|
Cut Tape (CT) | Automotive,AEC-Q100 | 36-BFSOP (0.295",7.50mm Width) Exposed Pad | PG-DSO-36-72 | Low-Side Switch | ||||
Infineon Technologies |
1,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOW-SIDE SWITCH DSO36-72
|
- | Automotive,AEC-Q100 | 36-BFSOP (0.295",7.50mm Width) Exposed Pad | PG-DSO-36-72 | Low-Side Switch | ||||
Texas Instruments |
163
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DIG MICROMIRROR DEVICE 42CLGA
|
- | - | 42-BFCLGA | 42-CLGA (14.12x4.97) | Digital Micromirror Device (DMD) | ||||
Bel Fuse Inc. |
195
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC POWERLINE MODULE 50SIP
|
Tray | - | 50-SSIP Module | 50-SIP Module | Powerline Module | ||||
Bel Fuse Inc. |
89
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC POWERLINE MODULE 50SIP
|
Tray | - | 50-SSIP Module | 50-SIP Module | Powerline Module | ||||
STMicroelectronics |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC FIRE LIGHTING CIRCUIT DPAK
|
Tape & Reel (TR) | - | TO-252-3,DPak (2 Leads + Tab),SC-63 | DPAK | Fire Lighting Circuit | ||||
STMicroelectronics |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC FIRE LIGHTING CIRCUIT DPAK
|
Cut Tape (CT) | - | TO-252-3,DPak (2 Leads + Tab),SC-63 | DPAK | Fire Lighting Circuit | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC FIRE LIGHTING CIRCUIT DPAK
|
Tube | - | TO-252-3,DPak (2 Leads + Tab),SC-63 | DPAK | Fire Lighting Circuit | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC SECURE AUTHENTICATOR 4WLCSP
|
Tape & Reel (TR) | - | 4-XFBGA,WLCSP | 4-WLCSP | Secure Authenticator |