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Découvrez les produits 7
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Series Package / Case Supplier Device Package Mounting Type
TDA8350Q/N6,112
NXP USA Inc.
Enquête
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MOQ: 552  MPQ: 1
IC DC COUPLED V-DEFL 13PDBS
- 13-SIP Formed Leads 13-PDBS Through Hole
TDA8351/N6,112
NXP USA Inc.
Enquête
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MOQ: 552  MPQ: 1
IC DC COUPLED V-DEFL 9SIL
- 9-SIP 9-PSIL Through Hole
TDA8356/N6,112
NXP USA Inc.
Enquête
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MOQ: 552  MPQ: 1
IC DC COUPLED V-DEFL 9SIL
- 9-SIP 9-PSIL Through Hole
TDA8359J/N2,112
NXP USA Inc.
Enquête
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MOQ: 864  MPQ: 1
IC FULL BRIDGE V-DEFL 9PDBS
- 9-SIP Exposed Tab,Formed Leads 9-PDBS-EP Surface Mount
TDA3653B/N2,112
NXP USA Inc.
Enquête
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MOQ: 748  MPQ: 1
IC VERT DEFLECT 9SIL
- 9-SIP Exposed Tab 9-SIL MPF Surface Mount
CD4529BCN
ON Semiconductor
Enquête
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MOQ: 250  MPQ: 1
IC DUAL 4 SGL CHANNEL DATA 16DIP
4000B 16-DIP (0.300",7.62mm) 16-PDIP Through Hole
LX5261CDP
Microsemi Corporation
Enquête
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MOQ: 25000  MPQ: 1
IC REG SCSI 27LINE LVD 16SOIC
- 16-SOIC (0.154",3.90mm Width) 16-SOIC Surface Mount