- Function:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Output Type:
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- Topology:
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- Accuracy:
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- Sensing Temperature:
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- Conditions sélectionnées:
Découvrez les produits 177
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Function | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Topology | Accuracy | Sensing Temperature | Output Alarm | Output Fan | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Function | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Topology | Accuracy | Sensing Temperature | Output Alarm | Output Fan | ||
Maxim Integrated |
2,909
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR MON 10-UMAX
|
Tube | Temp Monitoring System (Sensor) | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-uMAX | Surface Mount | I2C/SMBus | ADC,Multiplexer,Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No | ||||
NXP USA Inc. |
72,000
|
3 jours |
-
|
MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Register Bank | ±4°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
NXP USA Inc. |
74,656
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Register Bank | ±4°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
NXP USA Inc. |
74,656
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR 8-HWSON
|
- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Register Bank | ±4°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
Maxim Integrated |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC DETECTOR FAN FAIL 8-SOIC
|
Tape & Reel (TR) | Fan Control,Temp Monitor | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Active Low/Open Drain | Oscillator | - | - | Yes | Yes | ||||
Maxim Integrated |
2,679
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DETECTOR FAN FAIL 8-SOIC
|
Cut Tape (CT) | Fan Control,Temp Monitor | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Active Low/Open Drain | Oscillator | - | - | Yes | Yes | ||||
Maxim Integrated |
2,679
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DETECTOR FAN FAIL 8-SOIC
|
- | Fan Control,Temp Monitor | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Active Low/Open Drain | Oscillator | - | - | Yes | Yes | ||||
Maxim Integrated |
2,130
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DETECTOR FAN FAIL 8-SOIC
|
Tube | Fan Control,Temp Monitor | 3 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Active Low/Open Drain | Oscillator | - | - | Yes | Yes | ||||
Maxim Integrated |
892
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENS/MON 10-UMAX
|
Tube | Temp Monitoring System (Sensor) | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-uMAX | Surface Mount | I2C/SMBus | ADC,Multiplexer,Register Bank | ±2°C(Max) | -40°C ~ 125°C | Yes | No | ||||
Maxim Integrated |
1,663
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC THERM/RTC/CALENDAR DIG 8-SOIC
|
Tube | Thermometer,Thermostat | 2.7 V ~ 5.5 V | -55°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | I2C/SMBus | ADC,Comparator,Oscillator,Register Bank | ±2°C(Max) | -55°C ~ 125°C | Yes | No | ||||
Maxim Integrated |
2,310
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR MEMORY 8TDFN
|
Strip | Temp Monitoring System (Sensor),DIMM DDR Memory | 2.7 V ~ 3.6 V | -20°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | 2-Wire Serial,I2C/SMBUS | - | ±3°C(Max) | -20°C ~ 125°C | Yes | No | ||||
Maxim Integrated |
131
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CPU PERIPHERAL MON 24-TSSOP
|
Tube | Thermal Monitor,CPU Peripherals | 2.8 V ~ 5.75 V | -40°C ~ 125°C | 24-TSSOP (0.173",4.40mm Width) | 24-TSSOP | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Comparator,Fan Speed Control,Register Bank | ±12°C(Max) | -40°C ~ 125°C | No | Yes | ||||
Maxim Integrated |
161
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DDR MEMORY 8TSSOP
|
Tube | Temp Monitoring System (Sensor),DIMM DDR Memory | 2.7 V ~ 3.6 V | -20°C ~ 125°C | 8-TSSOP (0.173",4.40mm Width) | 8-TSSOP | Surface Mount | 2-Wire Serial,I2C/SMBUS | - | ±3°C(Max) | -20°C ~ 125°C | Yes | No | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP MONITOR I2C/SMBUS 10MSOP
|
Tape & Reel (TR) | Temp Monitoring System (Sensor),Watchdog | 3 V ~ 24 V | -40°C ~ 85°C | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Surface Mount | SMBus | ADC (Sigma Delta),Multiplexer,Register Bank | ±2°C | -40°C ~ 85°C | Yes | No | ||||
Microchip Technology |
1,229
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP MONITOR I2C/SMBUS 10MSOP
|
Cut Tape (CT) | Temp Monitoring System (Sensor),Watchdog | 3 V ~ 24 V | -40°C ~ 85°C | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Surface Mount | SMBus | ADC (Sigma Delta),Multiplexer,Register Bank | ±2°C | -40°C ~ 85°C | Yes | No | ||||
Microchip Technology |
1,229
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP MONITOR I2C/SMBUS 10MSOP
|
- | Temp Monitoring System (Sensor),Watchdog | 3 V ~ 24 V | -40°C ~ 85°C | 10-TFSOP,10-MSOP (0.118",3.00mm Width) | 10-MSOP | Surface Mount | SMBus | ADC (Sigma Delta),Multiplexer,Register Bank | ±2°C | -40°C ~ 85°C | Yes | No | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
|
Tape & Reel (TR) | Temp Monitoring System (Sensor),DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Comparator,Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
NXP USA Inc. |
2,987
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
|
Cut Tape (CT) | Temp Monitoring System (Sensor),DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Comparator,Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
NXP USA Inc. |
2,987
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC TEMP SENSOR DIMM 8HWSON
|
- | Temp Monitoring System (Sensor),DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | ADC (Sigma Delta),Comparator,Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MEMORY MOD TEMP SENSOR 8TDFN
|
Tape & Reel (TR) | Temp Monitoring System (Sensor),DIMM DDR Memory | 2.3 V ~ 3.6 V | -40°C ~ 125°C | 8-WDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | 2-Wire Serial,I2C/SMBUS | ADC (Sigma Delta),Comparator,Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No |