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- Conditions sélectionnées:
Découvrez les produits 280
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Sensor Type | Topology | Accuracy | Sensing Temperature | Output Alarm | Output Fan | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Output Type | Sensor Type | Topology | Accuracy | Sensing Temperature | Output Alarm | Output Fan | |
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Microchip Technology |
Enquête
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- |
-
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MOQ: 2500 MPQ: 1
|
IC FAN CTRLR 24QSOP
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- | Fan Control，Temp Monitor | 3.3V | 0°C ~ 70°C | 24-SSOP (0.154"，3.90mm Width) | 24-SSOP | Surface Mount | SMBus | Internal and External | ADC (Sigma Delta)，Multiplexer，Register Bank | ±3°C Local(Max)，±5°C Remote(Max) | 0°C ~ 70°C，-40°C ~ 125°C | Yes | Yes | ||
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Microchip Technology |
Enquête
|
- |
-
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MOQ: 1 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8TDFN
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- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -20°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC，Multiplexer，Register Bank | ±1% | - | No | No | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 2500 MPQ: 1
|
IC TEMP MONITOR 16SSOP
|
- | Temp Monitoring System (Sensor) | 2.8 V ~ 5.5 V | 0°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-SSOP | Surface Mount | SMBus | Internal and External | ADC，Multiplexer，Register Bank | ±3°C Local(Max)，±5°C Remote(Max) | 0°C ~ 125°C，External Sensor | Yes | No | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 3000 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HXSON
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-XFDFN Exposed Pad | 8-HXSON (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 3000 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | 2-Wire Serial，I2C/SMBUS | Internal | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C | -40°C ~ 125°C | Yes | Yes | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 4000 MPQ: 1
|
IC TEMPERATURE SENSOR DDR 8HWSON
|
- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±4°C(Max) | -40°C ~ 125°C | Yes | Yes | ||
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NXP USA Inc. |
Enquête
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- |
-
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MOQ: 4000 MPQ: 1
|
IC TEMP SENSOR DIMM 3.3V 8-HWSON
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-HWSON (2x3) | Surface Mount | 2-Wire Serial，I2C/SMBUS | Internal | ADC (Sigma Delta)，Comparator，Register Bank | ±3°C | -40°C ~ 125°C | Yes | Yes | ||
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Microchip Technology |
3,300
|
3 jours |
-
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MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR SPD EEPROM 8TDFN
|
- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 2.2 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | I2C | Internal | ADC (Sigma Delta)，EEPROM，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | |||
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Microchip Technology |
3,300
|
3 jours |
-
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MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TDFN
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- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No | |||
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Microchip Technology |
9,000
|
3 jours |
-
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MOQ: 3000 MPQ: 1
|
IC FAN FAILURE DETECTOR SOT23A-6
|
- | Fan Control，Temp Monitor | 3 V ~ 5.5 V | -40°C ~ 85°C | SOT-23-6 | SOT-23-6 | Surface Mount | Open Drain | Internal | Oscillator | - | -40°C ~ 85°C | Yes | Yes | |||
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Microchip Technology |
3,300
|
3 jours |
-
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MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR DGTL 8-DFN
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- | Temp Monitoring System (Sensor) | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 8-VFDFN Exposed Pad | 8-DFN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No | |||
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Microchip Technology |
3,300
|
3 jours |
-
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MOQ: 3300 MPQ: 1
|
IC DIMM TEMP SENSOR 8TDFN
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- | Temp Monitoring System (Sensor) | 1.7 V ~ 3.6 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | 2-Wire Serial，I2C | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | |||
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ON Semiconductor |
2,500
|
3 jours |
-
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MOQ: 2500 MPQ: 1
|
IC REMOTE THERMAL CTRLR 16QSOP
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dBCool | Fan Control，Temp Monitor | 3 V ~ 3.6 V | -40°C ~ 125°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | SMBus | Internal and External | ADC，Comparator，Fan Speed Counter，Multiplexer，Register Bank | ±1.5°C(Max) | -40°C ~ 125°C，External Sensor | No | Yes | |||
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Microchip Technology |
2,500
|
3 jours |
-
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MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR 2WIRE 3V 8-TSSOP
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- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No | |||
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IDT，Integrated Device Technology Inc |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENS EEPROM DFN-8
|
- | Temp Monitoring System (Sensor) | 2.3 V ~ 3.6 V | -20°C ~ 125°C | 8-WFDFN Exposed Pad | 8-VFQFPN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC，Register Bank | ±2°C | -20°C ~ 125°C | No | No | |||
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ON Semiconductor |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC SENSOR TEMP DUAL PREC 16QSOP
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- | Temp Monitoring System (Sensor) | 3 V ~ 5.5 V | 0°C ~ 120°C | 16-SSOP (0.154"，3.90mm Width) | 16-QSOP | Surface Mount | SMBus | Internal and External | ADC，Comparator，Multiplexer，Register Bank | ±1°C Local，±3°C Remote | 0°C ~ 120°C，External Sensor | Yes | No | |||
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Microchip Technology |
Enquête
|
- |
-
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MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-UDFN
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- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-UFDFN Exposed Pad | 8-UDFN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes | |||
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Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC TEMP SENSOR DGTL 8TSSOP
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- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 2.7 V ~ 5.5 V | -40°C ~ 125°C | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | No | |||
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Microchip Technology |
Enquête
|
- |
-
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MOQ: 2500 MPQ: 1
|
IC SENSOR THERMAL 3.0V 8TSSOP
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- | Temp Monitoring System (Sensor) | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-TSSOP (0.173"，4.40mm Width) | 8-TSSOP | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | No | Yes | |||
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Microchip Technology |
Enquête
|
- |
-
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MOQ: 3300 MPQ: 1
|
IC TEMP SENSOR 2WIRE 8-DFN
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- | Temp Monitoring System (Sensor)，DIMM DDR Memory | 3 V ~ 3.6 V | -40°C ~ 125°C | 8-VFDFN Exposed Pad | 8-DFN (2x3) | Surface Mount | I2C/SMBus | Internal | ADC (Sigma Delta)，Register Bank | ±3°C(Max) | -40°C ~ 125°C | Yes | Yes |
