- Packaging：
-
- Series：
-
- Voltage - Supply：
-
- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Conditions sélectionnées:
Découvrez les produits 17
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | |
|
|
|
Maxim Integrated |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC SW USB SNGL W/FB 8-TDFN
|
Tape & Reel (TR) | - | USB，Peripherals | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | ||
|
|
|
Maxim Integrated |
3,292
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB SW SGL AUTORESET 8TDFN
|
Cut Tape (CT) | - | USB，Peripherals | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | ||
|
|
|
Maxim Integrated |
3,292
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB SW SGL AUTORESET 8TDFN
|
- | - | USB，Peripherals | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 8-WDFN Exposed Pad | 8-TDFN-EP (3x3) | ||
|
|
|
ROHM Semiconductor |
Enquête
|
- |
-
|
MOQ: 250 MPQ: 1
|
CELL BALANCE LSI OF 4 TO 6 SERIE
|
Tape & Reel (TR) | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
ROHM Semiconductor |
215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CELL BALANCE LSI OF 4 TO 6 SERIE
|
Cut Tape (CT) | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
ROHM Semiconductor |
215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
CELL BALANCE LSI OF 4 TO 6 SERIE
|
- | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
ROHM Semiconductor |
Enquête
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC LSI CELL BALANCE 30HTSSOP
|
Tape & Reel (TR) | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
ROHM Semiconductor |
1,194
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LSI CELL BALANCE 30HTSSOP
|
Cut Tape (CT) | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
ROHM Semiconductor |
1,194
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LSI CELL BALANCE 30HTSSOP
|
- | Automotive，AEC-Q100 | Capacitor Bank Balancer | 8 V ~ 24 V | -40°C ~ 105°C | 30-VSSOP (0.220"，5.60mm Width) Exposed Pad | 30-HTSSOP-B | ||
|
|
|
Maxim Integrated |
100
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
PMIC BUCK BOOST LDO SWITCH 30WLP
|
- | - | Camera | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 30-WFBGA，WLBGA | 30-WLP (2.75x2.15) | ||
|
|
|
Maxim Integrated |
100
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
PMIC BUCK BOOST LDO SWITCH 30WLP
|
- | - | Camera | 2.7 V ~ 5.5 V | -40°C ~ 85°C | 30-WFBGA，WLBGA | 30-WLP (2.75x2.15) | ||
|
|
ON Semiconductor |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC USB TYPE C VCONN OVP 4WLCSP
|
Tape & Reel (TR) | - | USB Type C | 28V | -40°C ~ 85°C | 4-UFBGA，WLCSP | 4-WLCSP (0.84x0.84) | |||
|
|
ON Semiconductor |
4,977
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C VCONN OVP 4WLCSP
|
Cut Tape (CT) | - | USB Type C | 28V | -40°C ~ 85°C | 4-UFBGA，WLCSP | 4-WLCSP (0.84x0.84) | |||
|
|
ON Semiconductor |
4,977
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C VCONN OVP 4WLCSP
|
- | - | USB Type C | 28V | -40°C ~ 85°C | 4-UFBGA，WLCSP | 4-WLCSP (0.84x0.84) | |||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC USB TYPE C VCONN OVP 6UDFN
|
Tape & Reel (TR) | - | USB Type C | 28V | -40°C ~ 85°C | 6-UDFN Exposed Pad | 6-UDFN (2x2) | |||
|
|
ON Semiconductor |
2,575
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C VCONN OVP 6UDFN
|
Cut Tape (CT) | - | USB Type C | 28V | -40°C ~ 85°C | 6-UDFN Exposed Pad | 6-UDFN (2x2) | |||
|
|
ON Semiconductor |
2,575
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC USB TYPE C VCONN OVP 6UDFN
|
- | - | USB Type C | 28V | -40°C ~ 85°C | 6-UDFN Exposed Pad | 6-UDFN (2x2) |
