- Packaging：
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- Applications：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Conditions sélectionnées:
Découvrez les produits 149
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | |
|
|
|
NXP USA Inc. |
195
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
471
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOTOR DRIVER 36V 48LQFP
|
Tray | Pump，Valve Controller | 6 V ~ 36 V | -40°C ~ 125°C | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
238
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
160
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
240
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
FS6500
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
240
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
218
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
144
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 125°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP，LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
180
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SBC，DCDC 1.5A VCORE FS1B CAN,15
|
Tray | System Basis Chip | -1.0 V ~ 40 V | -40°C ~ 150°C (TA) | 48-LQFP Exposed Pad | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP CAN 48LQFP
|
Tray | System Basis Chip | 2.7 V ~ 36 V | -40°C ~ 125°C | 48-LQFP Exposed Pad | 13mA | ||
|
|
|
NXP USA Inc. |
217
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SYSTEM BASIS CHIP CAN 48LQFP
|
Tray | System Basis Chip | 2.7 V ~ 36 V | -40°C ~ 125°C | 48-LQFP Exposed Pad | 13mA |
