- Packaging:
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- Applications:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Conditions sélectionnées:
Découvrez les produits 17
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Operating Temperature | Package / Case | Current - Supply | ||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC POWER SUPPLY MCU 3A 32-SOIC
|
Tape & Reel (TR) | Power Supplies | 2.8 V ~ 6 V | -40°C ~ 85°C | 32-BSSOP (0.295",7.50mm Width) | 60mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC POWER SUPPLY MCU 3A 32-SOIC
|
Cut Tape (CT) | Power Supplies | 2.8 V ~ 6 V | -40°C ~ 85°C | 32-BSSOP (0.295",7.50mm Width) | 60mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC POWER SUPPLY MCU 3A 32-SOIC
|
Tube | Power Supplies | 2.8 V ~ 6 V | -40°C ~ 85°C | 32-BSSOP (0.295",7.50mm Width) | 60mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SYSTEM BASIS CHIP LIN 32-SOIC
|
Tube | Automotive | 5.5 V ~ 18 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) | 5mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SYSTEM BASIS CHIP LIN 32-SOIC
|
Tape & Reel (TR) | Automotive | 5.5 V ~ 18 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) | 5mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA | ||||
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | 5.5 V ~ 28 V | -40°C ~ 125°C | 32-BSSOP (0.295",7.50mm Width) Exposed Pad | 2mA |