- Packaging：
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- Applications：
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- Voltage - Supply：
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- Package / Case：
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- Supplier Device Package：
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- Conditions sélectionnées:
Découvrez les produits 86
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Package / Case | Supplier Device Package | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Voltage - Supply | Package / Case | Supplier Device Package | Current - Supply | |
|
|
|
NXP USA Inc. |
195
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
118
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
TRANSFORMER PHYSICAL LAYER
|
Tube | Isolated Communications Interface | 4.5 V ~ 7 V | 16-SOIC (0.154"，3.90mm Width) | 16-SOIC | 40mA | ||
|
|
|
NXP USA Inc. |
238
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
160
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
240
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
150
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
240
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
123
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
144
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 2.2A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
9
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tray | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 2000 MPQ: 1
|
SYSTEM BASIS CHIP LINEAR 0.5A V
|
Tape & Reel (TR) | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 2000 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 0.8A VCO
|
Tape & Reel (TR) | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 2000 MPQ: 1
|
SYSTEM BASIS CHIP DCDC 1.5A VCO
|
Tape & Reel (TR) | System Basis Chip | -1.0 V ~ 40 V | 48-LQFP Exposed Pad | 48-LQFP (7x7) | - |
