- Packaging：
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- Applications：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Conditions sélectionnées:
Découvrez les produits 21
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Applications | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Current - Supply | |
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NXP USA Inc. |
Enquête
|
- |
-
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MOQ: 42 MPQ: 1
|
IC SWITCH HIGH SIDE 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC EP | Surface Mount | 2mA | ||
|
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NXP USA Inc. |
Enquête
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC SWITCH HIGH SIDE 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC EP | Surface Mount | 2mA | ||
|
|
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SWITCH HIGH SIDE
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC EP | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SWITCH HIGH SIDE
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC EP | Surface Mount | 2mA | ||
|
|
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
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NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tape & Reel (TR) | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPD CAN 3.3V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SBC HIGH SPEED CAN 5V 32SOIC
|
Tube | System Basis Chip | -40°C ~ 125°C | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 32-SOIC | Surface Mount | 2mA | ||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC DRIVER HALF BRIDGE HEX
|
Tape & Reel (TR) | Automotive | -40°C ~ 150°C | 36-BFSOP (0.295"，7.50mm Width) Exposed Pad | 36-SSOP | Surface Mount | 7.5mA | |||
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|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC DRIVER HALF BRIDGE HEX
|
Cut Tape (CT) | Automotive | -40°C ~ 150°C | 36-BFSOP (0.295"，7.50mm Width) Exposed Pad | 36-SSOP | Surface Mount | 7.5mA | |||
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|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC DRIVER HALF BRIDGE HEX
|
- | Automotive | -40°C ~ 150°C | 36-BFSOP (0.295"，7.50mm Width) Exposed Pad | 36-SSOP | Surface Mount | 7.5mA | |||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC DRIVER HALF BRIDGE 36SSOP
|
Tape & Reel (TR) | Automotive | -40°C ~ 150°C | 36-BFSOP (0.295"，7.50mm Width) Exposed Pad | 36-SSOP | Surface Mount | 7.5mA |
