- Packaging：
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- Interface：
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- Operating Temperature：
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- Package / Case：
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- Ratio - Input:Output：
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- Voltage - Supply (Vcc/Vdd)：
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- Output Configuration：
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- Rds On (Typ)：
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- Voltage - Load：
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- Current - Output (Max)：
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Découvrez les produits 14
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Interface | Operating Temperature | Package / Case | Ratio - Input:Output | Voltage - Supply (Vcc/Vdd) | Number of Outputs | Output Configuration | Rds On (Typ) | Voltage - Load | Current - Output (Max) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Interface | Operating Temperature | Package / Case | Ratio - Input:Output | Voltage - Supply (Vcc/Vdd) | Number of Outputs | Output Configuration | Rds On (Typ) | Voltage - Load | Current - Output (Max) | |
|
|
|
NXP USA Inc. |
13,000
|
3 jours |
-
|
MOQ: 1000 MPQ: 1
|
IC SW SERIAL OCTAL 32SOIC
|
Tape & Reel (TR) | SPI | -40°C ~ 125°C (TA) | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
13,276
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SW SERIAL OCTAL 32SOIC
|
Cut Tape (CT) | SPI | -40°C ~ 125°C (TA) | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
13,276
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SW SERIAL OCTAL 32SOIC
|
- | SPI | -40°C ~ 125°C (TA) | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
5,779
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC SW SERIAL OCTAL 32SOIC
|
Tube | SPI | -40°C ~ 125°C (TA) | 32-BSSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
42
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRIVER LO SIDE 6CH 32SOIC
|
Tube | SPI，Parallel | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04236111111111111 | 4.5 V ~ 5.5 V | 6 | Low Side | 400 mOhm | 8 V ~ 25 V | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC DRIVER LO SIDE 6CH 32SOIC
|
Tape & Reel (TR) | SPI，Parallel | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04236111111111111 | 4.5 V ~ 5.5 V | 6 | Low Side | 400 mOhm | 8 V ~ 25 V | - | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SERIAL SWITCH OCTAL 32-SOIC
|
Tape & Reel (TR) | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SERIAL SWITCH OCTAL 32-SOIC
|
Cut Tape (CT) | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC SERIAL SWITCH OCTAL 32-SOIC
|
- | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SW SERIAL OCTAL 32-SOIC
|
Tube | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 26.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SERIAL SWITCH OCTAL 32SOIC
|
Tape & Reel (TR) | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04444444444444445 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 26.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SERIAL SWITCH OCTAL 32-SOIC
|
Tube | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 27.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 42 MPQ: 1
|
IC SWITCH HI/LO SIDE 16B 32-SOIC
|
Tube | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 26.5 V | 600mA | ||
|
|
|
NXP USA Inc. |
Enquête
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC SWITCH HI/LO SIDE 16B 32-SOIC
|
Tape & Reel (TR) | SPI | -40°C ~ 150°C (TJ) | 32-SSOP (0.295"，7.50mm Width) Exposed Pad | 0.04722222222222222 | 3.1 V ~ 5.5 V | 8 | High Side or Low Side | 750 mOhm | 5.5 V ~ 26.5 V | 600mA |
