- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Channel Type:
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- Driven Configuration:
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- Gate Type:
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- Rise / Fall Time (Typ):
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- Logic Voltage - VIL, VIH:
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- Current - Peak Output (Source, Sink):
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- Conditions sélectionnées:
Découvrez les produits 1,511
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
2,995
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
- | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,475
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,475
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,387
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,387
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
2,341
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
- | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel,P-Channel MOSFET | - | 11.5ns,10ns | 0.8V,2V | 1.5A,1.5A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRIVER MOSFET 1.5A DUAL 8SOIC
|
Tape & Reel (TR) | - | 4.5 V ~ 20 V | -40°C ~ 125°C (TJ) | 8-SOIC (0.154",3.90mm Width) Exposed Pad | 8-SOIC-EP | Surface Mount | Inverting,Non-Inverting | Independent | Low-Side | 2 | N-Channel MOSFET | - | 20ns,18ns | 0.8V,2.4V | 1.5A,1.5A |