- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Channel Type：
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- Driven Configuration：
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- Logic Voltage - VIL, VIH：
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- Current - Peak Output (Source, Sink)：
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- Conditions sélectionnées:
Découvrez les produits 34
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Cut Tape (CT) | -40°C ~ 125°C (TA) | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
- | -40°C ~ 125°C (TA) | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Single | Low-Side | 2 | IGBT | 0.8V，2V | 4.5A，4.5A | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Independent | High-Side | 2 | IGBT | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,000
|
3 jours |
-
|
MOQ: 500 MPQ: 1
|
IC DVR MOSFET LOW SIDE 4TQFN
|
Tape & Reel (TR) | -40°C ~ 125°C (TJ) | 4-UQFN | 4-TQFN (1.2x1.2) | Surface Mount | Single | Low-Side | 1 | N-Channel MOSFET | 0.8V，3V | 1.5A，1.5A | |||
|
|
Microchip Technology |
1,164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DVR MOSFET LOW SIDE 4TQFN
|
Cut Tape (CT) | -40°C ~ 125°C (TJ) | 4-UQFN | 4-TQFN (1.2x1.2) | Surface Mount | Single | Low-Side | 1 | N-Channel MOSFET | 0.8V，3V | 1.5A，1.5A |
