- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Channel Type:
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- Driven Configuration:
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- Rise / Fall Time (Typ):
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- Logic Voltage - VIL, VIH:
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- Current - Peak Output (Source, Sink):
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- Conditions sélectionnées:
Découvrez les produits 29
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Channel Type | Driven Configuration | Number of Drivers | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Channel Type | Driven Configuration | Number of Drivers | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
Infineon Technologies |
Enquête
|
- |
-
|
MOQ: 66 MPQ: 1
|
IC DRIVER BRIDGE 3-PHASE 64-MQFP
|
Tray | 12.5 V ~ 20 V | -40°C ~ 150°C (TJ) | 64-BQFP | 64-MQFP (20x14) | 3-Phase | Half-Bridge | 3 | 600V | 115ns,25ns | - | - | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,275
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,498
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Independent | High-Side | 2 | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Single | Low-Side | 2 | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A |