- Packaging：
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- Series：
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- Voltage - Supply：
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- Package / Case：
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- Supplier Device Package：
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- Driven Configuration：
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- Gate Type：
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- Rise / Fall Time (Typ)：
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- Logic Voltage - VIL, VIH：
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- Current - Peak Output (Source, Sink)：
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- Conditions sélectionnées:
Découvrez les produits 37
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Package / Case | Supplier Device Package | Input Type | Driven Configuration | Gate Type | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Package / Case | Supplier Device Package | Input Type | Driven Configuration | Gate Type | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
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Maxim Integrated |
Enquête
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- |
-
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MOQ: 0 MPQ: 1
|
IC GATE DRVR 2CH 16NS 10TDFN
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Tape & Reel (TR) | Automotive，AEC-Q100 | 4.5 V ~ 28 V | 10-WFDFN Exposed Pad | 10-TDFN-EP (3x3) | Inverting，Non-Inverting | Low-Side | N-Channel MOSFET | 48ns，32ns | 2V，4.25V | 2A，4A | ||
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Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
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Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
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Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
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Microchip Technology |
1,200
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
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Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
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Microchip Technology |
1,200
|
3 jours |
-
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MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
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|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A | |||
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Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Inverting，Non-Inverting | High-Side | IGBT | 12ns，12ns | 0.8V，2V | 3A，3A |
