- Packaging：
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- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Gate Type：
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- Rise / Fall Time (Typ)：
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- Conditions sélectionnées:
Découvrez les produits 38
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | |
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Texas Instruments |
Enquête
|
- |
-
|
MOQ: 54 MPQ: 1
|
IC DRIVER QUAD HI SIDE 20-DIP
|
Tube | 7 V ~ 28 V | -25°C ~ 150°C (TJ) | 20-DIP (0.300"，7.62mm) | 20-DIP | Through Hole | Non-Inverting | 4 | N-Channel MOSFET | - | ||
|
|
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Texas Instruments |
Enquête
|
- |
-
|
MOQ: 36 MPQ: 1
|
IC DRIVER QUAD HI SIDE 20-DIP
|
Tube | 7 V ~ 28 V | -25°C ~ 150°C (TJ) | 20-DIP (0.300"，7.62mm) | 20-DIP | Through Hole | Non-Inverting | 4 | N-Channel MOSFET | - | ||
|
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Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns | |||
|
|
Microchip Technology |
3,298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | 2 | IGBT | 12ns，12ns |
