- Packaging：
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- Operating Temperature：
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- Supplier Device Package：
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- Channel Type：
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- Driven Configuration：
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- Gate Type：
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- Rise / Fall Time (Typ)：
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- Current - Peak Output (Source, Sink)：
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- Conditions sélectionnées:
Découvrez les produits 36
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Supplier Device Package | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Current - Peak Output (Source, Sink) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Supplier Device Package | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Current - Peak Output (Source, Sink) | |
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Non-Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Non-Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C (TA) | 8-TDFN (2x3) | Non-Inverting | Single | Low-Side | 2 | IGBT | 12ns，12ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-TDFN (2x3) | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-TDFN (2x3) | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TDFN (2x3) | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MOSFET DRIVER 4.5A 8WDFN
|
Tape & Reel (TR) | -40°C ~ 150°C (TJ) | 8-WDFN (2x2) | Inverting | Single | Low-Side | 1 | N-Channel，P-Channel MOSFET | 9.5ns，9ns | 4.5A，4.5A | |||
|
|
Microchip Technology |
2,973
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DRIVER 4.5A 8WDFN
|
Cut Tape (CT) | -40°C ~ 150°C (TJ) | 8-WDFN (2x2) | Inverting | Single | Low-Side | 1 | N-Channel，P-Channel MOSFET | 9.5ns，9ns | 4.5A，4.5A |
