- Packaging:
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- Series:
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- Voltage - Supply:
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- Package / Case:
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- Supplier Device Package:
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- Channel Type:
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- Driven Configuration:
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- Rise / Fall Time (Typ):
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- Logic Voltage - VIL, VIH:
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- Current - Peak Output (Source, Sink):
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- Conditions sélectionnées:
Découvrez les produits 69
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Package / Case | Supplier Device Package | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Package / Case | Supplier Device Package | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
Microchip Technology |
6,600
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
IC MOSFET DRIVER 6A HS 8SOIC
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Single | Low-Side | 1 | IGBT,N-Channel,P-Channel MOSFET | 20ns,20ns | 0.8V,2.4V | 6A,6A | ||||
Microchip Technology |
8,345
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DRIVER 6A HS 8SOIC
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Single | Low-Side | 1 | IGBT,N-Channel,P-Channel MOSFET | 20ns,20ns | 0.8V,2.4V | 6A,6A | ||||
Microchip Technology |
8,345
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DRIVER 6A HS 8SOIC
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Single | Low-Side | 1 | IGBT,N-Channel,P-Channel MOSFET | 20ns,20ns | 0.8V,2.4V | 6A,6A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
Enquête
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,298
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Non-Inverting | Independent | High-Side | 2 | IGBT | 12ns,12ns | 0.8V,2V | 3A,3A |