- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Channel Type：
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- Gate Type：
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- Rise / Fall Time (Typ)：
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- Current - Peak Output (Source, Sink)：
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- Conditions sélectionnées:
Découvrez les produits 54
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Current - Peak Output (Source, Sink) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Number of Drivers | Gate Type | Rise / Fall Time (Typ) | Current - Peak Output (Source, Sink) | |
|
Linear Technology/Analog Devices |
140
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DRIVER HIGH-SIDE 8SOIC
|
Tube | 0°C ~ 70°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Single | 1 | N-Channel MOSFET | - | - | |||
|
|
Linear Technology/Analog Devices |
555
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DRIVER HIGH-SIDE 8SOIC
|
Tube | -40°C ~ 150°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Single | 1 | N-Channel MOSFET | - | - | |||
|
|
Linear Technology/Analog Devices |
1,290
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR HI-SIDE DUAL 8SOIC
|
Tube | 0°C ~ 70°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Independent | 2 | N-Channel MOSFET | - | - | |||
|
|
Linear Technology/Analog Devices |
2,765
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR HI-SIDE DUAL 8SOIC
|
Tube | -40°C ~ 85°C (TA) | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Independent | 2 | N-Channel MOSFET | - | - | |||
|
|
Linear Technology/Analog Devices |
250
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR HI-SIDE QUAD16SOIC
|
Tube | 0°C ~ 70°C (TA) | 16-SOIC (0.295"，7.50mm Width) | 16-SOIC | Surface Mount | Non-Inverting | Independent | 4 | N-Channel MOSFET | - | - | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
3,300
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,175
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,700
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A | |||
|
|
Microchip Technology |
1,200
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting，Non-Inverting | Independent | 2 | IGBT | 12ns，12ns | 3A，3A |
