Découvrez les produits 10
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Interface Voltage - Supply Operating Temperature Package / Case Supplier Device Package Current - Output / Channel Voltage - Load
TB67Z800FTG,EL
Toshiba Semiconductor and Storage
2,000
3 jours
-
MOQ: 2000  MPQ: 1
INVERTER/3 HALF BRIDGE MOSFETS W
Tape & Reel (TR) - - - 36-VFQFN Exposed Pad 36-VQFN (5x5) - -
TB67Z800FTG,EL
Toshiba Semiconductor and Storage
3,950
3 jours
-
MOQ: 1  MPQ: 1
INVERTER/3 HALF BRIDGE MOSFETS W
Cut Tape (CT) - - - 36-VFQFN Exposed Pad 36-VQFN (5x5) - -
TB67Z800FTG,EL
Toshiba Semiconductor and Storage
3,950
3 jours
-
MOQ: 1  MPQ: 1
INVERTER/3 HALF BRIDGE MOSFETS W
- - - - 36-VFQFN Exposed Pad 36-VQFN (5x5) - -
MC33HB2000FK
NXP USA Inc.
260
3 jours
-
MOQ: 1  MPQ: 1
H-BRIDGE SPI BRUSHED DC MOTOR
Tray - - - 32-PowerQFN 32-PQFN (8x8) - -
BA5830FP-E2
ROHM Semiconductor
Enquête
-
-
MOQ: 1500  MPQ: 1
IC BRIDGE DRIVER PAR 28HSOP
Tape & Reel (TR) Logic 4.5 V ~ 14 V -40°C ~ 85°C (TA) 28-SOP (0.295",7.50mm Width) 28-HSOP-M 1A 6V
BD7996EFV-E2
ROHM Semiconductor
Enquête
-
-
MOQ: 1500  MPQ: 1
IC BRIDGE DRIVER PAR 54HTSSOP
Tape & Reel (TR) Logic 4.3 V ~ 14 V -20°C ~ 75°C (TA) 54-VSSOP (0.295",7.50mm Width) Exposed Pad 54-HTSSOP-B 1.2A -
MC33HB2000FKR2
NXP USA Inc.
Enquête
-
-
MOQ: 2000  MPQ: 1
H-BRIDGE SPI BRUSHED DC MOTOR
Tape & Reel (TR) - - - 32-PowerQFN 32-PQFN (8x8) - -
FDMF3032
ON Semiconductor
Enquête
-
-
MOQ: 3000  MPQ: 1
MODULE SPS 2MHZ
Tape & Reel (TR) - - - 31-PowerWFQFN 31-PQFN (5x5) - -
FDMF3032
ON Semiconductor
Enquête
-
-
MOQ: 1  MPQ: 1
MODULE SPS 2MHZ
Cut Tape (CT) - - - 31-PowerWFQFN 31-PQFN (5x5) - -
FDMF3032
ON Semiconductor
Enquête
-
-
MOQ: 1  MPQ: 1
MODULE SPS 2MHZ
- - - - 31-PowerWFQFN 31-PQFN (5x5) - -