- Function:
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- Operating Temperature:
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- Package / Case:
-
- Supplier Device Package:
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- Mounting Type:
-
- Voltage - Input:
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- Sensing Method:
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- Conditions sélectionnées:
Découvrez les produits 50
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Function | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Function | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | ||
STMicroelectronics |
1,656
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC CURRENT SOURCE 3% 8SOIC
|
- | Current Source | -25°C ~ 100°C | 8-SOIC (0.154",3.90mm Width) | 8-SO | Surface Mount | 1 V ~ 40 V | 10mA | - | ±3% | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VFDFPN
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
1,524
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VFDFPN
|
Cut Tape (CT) | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
1,524
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VFDFPN
|
- | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC ELECTRONIC FUSE
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 14-TSSOP (0.173",4.40mm Width) Exposed Pad | 14-HTSSOP | Surface Mount | 8 V ~ 48 V | 4A | - | ±5% | ||||
STMicroelectronics |
1,317
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE
|
Cut Tape (CT) | Electronic Fuse | -40°C ~ 125°C (TJ) | 14-TSSOP (0.173",4.40mm Width) Exposed Pad | 14-HTSSOP | Surface Mount | 8 V ~ 48 V | 4A | - | ±5% | ||||
STMicroelectronics |
1,317
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE
|
- | Electronic Fuse | -40°C ~ 125°C (TJ) | 14-TSSOP (0.173",4.40mm Width) Exposed Pad | 14-HTSSOP | Surface Mount | 8 V ~ 48 V | 4A | - | ±5% | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VDFPN
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
956
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VDFPN
|
Cut Tape (CT) | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
956
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10VDFPN
|
- | Electronic Fuse | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
Cut Tape (CT) | Electronic Fuse | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
- | Electronic Fuse | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC ELECTRONIC FUSE 5V FLIPCHIP9
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 4.5 V ~ 8 V | 2.5A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
IC ELECTRONIC FUSE 5V FLIPCHIP9
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 4.5 V ~ 8 V | 2.5A | - | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 10VFDFPN
|
Tape & Reel (TR) | Electronic Fuse | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 10V | 5A | High-Side | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 10VFDFPN
|
Cut Tape (CT) | Electronic Fuse | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 10V | 5A | High-Side | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 10VFDFPN
|
- | Electronic Fuse | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 10V | 5A | High-Side | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC SENSOR TEMP ADJ CUR MODE TO92
|
Bulk | Current Source | 0°C ~ 70°C | TO-226-3,TO-92-3 (TO-226AA) | TO-92-3 | Through Hole | 1 V ~ 40 V | 10mA | - | ±3% | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CURRENT SOURCE 3% TO92-3
|
Bulk | Current Source | -25°C ~ 100°C | TO-226-3,TO-92-3 (TO-226AA) | TO-92-3 | Through Hole | 1 V ~ 40 V | 10mA | - | ±3% |