- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Voltage - Input:
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- Current - Output:
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- Sensing Method:
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- Conditions sélectionnées:
Découvrez les produits 333
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | ||
STMicroelectronics |
6,116
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10DFN
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 7.6 V ~ 18 V | 3.6A | - | - | ||||
STMicroelectronics |
6,116
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10DFN
|
- | - | -40°C ~ 125°C (TJ) | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 7.6 V ~ 18 V | 3.6A | - | - | ||||
Texas Instruments |
1,250
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 8WSON
|
Tape & Reel (TR) | - | -40°C ~ 125°C (TJ) | 8-WFDFN Exposed Pad | 8-WSON (2x2) | Surface Mount | 2.7 V ~ 18 V | 4A | - | ±7.5% | ||||
Texas Instruments |
1,370
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 8WSON
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 8-WFDFN Exposed Pad | 8-WSON (2x2) | Surface Mount | 2.7 V ~ 18 V | 4A | - | ±7.5% | ||||
Texas Instruments |
1,370
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 8WSON
|
- | - | -40°C ~ 125°C (TJ) | 8-WFDFN Exposed Pad | 8-WSON (2x2) | Surface Mount | 2.7 V ~ 18 V | 4A | - | ±7.5% | ||||
Texas Instruments |
250
|
3 jours |
-
|
MOQ: 250 MPQ: 1
|
IC PWR MGMT EFUSE 60V 24VQFN
|
Tape & Reel (TR) | - | -40°C ~ 125°C (TJ) | 24-VFQFN Exposed Pad | 24-VQFN (5x4) | Surface Mount | 4.2 V ~ 55 V | 2.35A | - | ±5% | ||||
Texas Instruments |
316
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 60V 24VQFN
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 24-VFQFN Exposed Pad | 24-VQFN (5x4) | Surface Mount | 4.2 V ~ 55 V | 2.35A | - | ±5% | ||||
Texas Instruments |
316
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 60V 24VQFN
|
- | - | -40°C ~ 125°C (TJ) | 24-VFQFN Exposed Pad | 24-VQFN (5x4) | Surface Mount | 4.2 V ~ 55 V | 2.35A | - | ±5% | ||||
Diodes Incorporated |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
920
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
Enquête
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
- | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC LOAD SWITCH 12V 3.6A 10-UDFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
5,476
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 12V 3.6A 10-UDFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
5,476
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 12V 3.6A 10-UDFN
|
- | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | ||||
STMicroelectronics |
Enquête
|
- |
-
|
MOQ: 5000 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
Tape & Reel (TR) | - | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
STMicroelectronics |
2,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
ELECTRONIC FUSE FOR 3.3 V LINE
|
- | - | -40°C ~ 125°C (TJ) | 9-UFBGA,FCBGA | 9-FlipChip (1.2x1.2) | Surface Mount | 3.1 V ~ 8 V | 3.6A | - | - | ||||
Diodes Incorporated |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
2,751
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | ||||
Diodes Incorporated |
2,751
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC LOAD SWITCH 10UDFN
|
- | - | -40°C ~ 150°C | 10-UFDFN Exposed Pad | U-DFN3030-10 | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - |