- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Voltage - Input：
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- Current - Output：
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- Sensing Method：
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- Conditions sélectionnées:
Découvrez les produits 333
 |
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Voltage - Input | Current - Output | Sensing Method | Accuracy | |
|
Texas Instruments |
3,487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 20WQFN
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 20-WFQFN Exposed Pad | 20-WQFN (4x3) | Surface Mount | 2.7 V ~ 18 V | 5.3A | - | ±8% | |||
|
|
Texas Instruments |
3,487
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 20WQFN
|
- | - | -40°C ~ 125°C (TJ) | 20-WFQFN Exposed Pad | 20-WQFN (4x3) | Surface Mount | 2.7 V ~ 18 V | 5.3A | - | ±8% | |||
|
|
ON Semiconductor |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 10DFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
3,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 10DFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
3,884
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 10DFN
|
- | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 3.1 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
3,000
|
3 jours |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 5.85V 10WDFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 5V | - | High-Side | - | |||
|
|
ON Semiconductor |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 5.85V 10WDFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 5V | - | High-Side | - | |||
|
|
ON Semiconductor |
3,000
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 5.85V 10WDFN
|
- | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 5V | - | High-Side | - | |||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10DFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
2,681
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10DFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
2,681
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10DFN
|
- | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10WDFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 3.3V | - | High-Side | - | |||
|
|
ON Semiconductor |
2,755
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10WDFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 3.3V | - | High-Side | - | |||
|
|
ON Semiconductor |
2,755
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 3.3V 10WDFN
|
- | - | -40°C ~ 150°C | 10-WFDFN Exposed Pad | 10-WDFN (3x3) | Surface Mount | 3.3V | - | High-Side | - | |||
|
|
ON Semiconductor |
Enquête
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10-DFN
|
Tape & Reel (TR) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
154
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10-DFN
|
Cut Tape (CT) | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
ON Semiconductor |
154
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC ELECTRONIC FUSE 12V 10-DFN
|
- | - | -40°C ~ 150°C | 10-VFDFN Exposed Pad | 10-DFN (3x3) | Surface Mount | 9 V ~ 18 V | 3.6A | High-Side | - | |||
|
|
Texas Instruments |
Enquête
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 20WQFN
|
Tape & Reel (TR) | - | -40°C ~ 125°C (TJ) | 20-WFQFN Exposed Pad | 20-WQFN (4x3) | Surface Mount | 2.7 V ~ 18 V | 5.3A | - | ±8% | |||
|
|
Texas Instruments |
297
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 20WQFN
|
Cut Tape (CT) | - | -40°C ~ 125°C (TJ) | 20-WFQFN Exposed Pad | 20-WQFN (4x3) | Surface Mount | 2.7 V ~ 18 V | 5.3A | - | ±8% | |||
|
|
Texas Instruments |
297
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC PWR MGMT EFUSE 2.7-18V 20WQFN
|
- | - | -40°C ~ 125°C (TJ) | 20-WFQFN Exposed Pad | 20-WQFN (4x3) | Surface Mount | 2.7 V ~ 18 V | 5.3A | - | ±8% |
