Découvrez les produits 28
Image Numéro de pièce Fabricant Quantité Délai de livraison Prix ​​unitaire Acheter Description Packaging Operating Temperature Package / Case Supplier Device Package Current - Output Sensing Method
NIS5132MN1-FN-7
Diodes Incorporated
3,000
3 jours
-
MOQ: 3000  MPQ: 1
IC LOAD SWITCH 12V 3.6A 10-UDFN
Tape & Reel (TR) -40°C ~ 150°C 10-UFDFN Exposed Pad U-DFN3030-10 3.6A High-Side
NIS5132MN1-FN-7
Diodes Incorporated
5,476
3 jours
-
MOQ: 1  MPQ: 1
IC LOAD SWITCH 12V 3.6A 10-UDFN
Cut Tape (CT) -40°C ~ 150°C 10-UFDFN Exposed Pad U-DFN3030-10 3.6A High-Side
NIS5132MN1-FN-7
Diodes Incorporated
5,476
3 jours
-
MOQ: 1  MPQ: 1
IC LOAD SWITCH 12V 3.6A 10-UDFN
- -40°C ~ 150°C 10-UFDFN Exposed Pad U-DFN3030-10 3.6A High-Side
NIS5132MN2-FN-7
Diodes Incorporated
Enquête
-
-
MOQ: 1  MPQ: 1
IC LOAD SWITCH 12V 3.6A 10-UDFN
Cut Tape (CT) -40°C ~ 150°C 10-UFDFN Exposed Pad U-DFN3030-10 3.6A High-Side
NIS5132MN2-FN-7
Diodes Incorporated
Enquête
-
-
MOQ: 1  MPQ: 1
IC LOAD SWITCH 12V 3.6A 10-UDFN
- -40°C ~ 150°C 10-UFDFN Exposed Pad U-DFN3030-10 3.6A High-Side
NIS5112D1R2G
ON Semiconductor
2,500
3 jours
-
MOQ: 2500  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
Tape & Reel (TR) -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5112D1R2G
ON Semiconductor
4,975
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
Cut Tape (CT) -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5112D1R2G
ON Semiconductor
4,975
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
- -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5112D2R2G
ON Semiconductor
2,500
3 jours
-
MOQ: 2500  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
Tape & Reel (TR) -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5112D2R2G
ON Semiconductor
3,771
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
Cut Tape (CT) -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5112D2R2G
ON Semiconductor
3,771
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE HOTSWAP 8SOIC
- -40°C ~ 175°C 8-SOIC (0.154",3.90mm Width) 8-SOIC 2A -
NIS5132MN1TXG
ON Semiconductor
9,000
3 jours
-
MOQ: 3000  MPQ: 1
IC ELECTRONIC FUSE 10DFN
Tape & Reel (TR) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side
NIS5132MN1TXG
ON Semiconductor
10,990
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 10DFN
Cut Tape (CT) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side
NIS5132MN1TXG
ON Semiconductor
10,990
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 10DFN
- -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side
NIS5232MN1TXG
ON Semiconductor
12,000
3 jours
-
MOQ: 3000  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
Tape & Reel (TR) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 4.2A High-Side
NIS5232MN1TXG
ON Semiconductor
13,990
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
Cut Tape (CT) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 4.2A High-Side
NIS5232MN1TXG
ON Semiconductor
13,990
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
- -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 4.2A High-Side
NIS5132MN2TXG
ON Semiconductor
Enquête
-
-
MOQ: 3000  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
Tape & Reel (TR) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side
NIS5132MN2TXG
ON Semiconductor
2,681
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
Cut Tape (CT) -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side
NIS5132MN2TXG
ON Semiconductor
2,681
3 jours
-
MOQ: 1  MPQ: 1
IC ELECTRONIC FUSE 12V 10DFN
- -40°C ~ 150°C 10-VFDFN Exposed Pad 10-DFN (3x3) 3.6A High-Side