- Series:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Memory Size:
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- Technology:
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- Memory Format:
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- Clock Frequency:
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- Write Cycle Time - Word, Page:
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- Conditions sélectionnées:
Découvrez les produits 530
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Technology | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | |
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Image | Numéro de pièce | Fabricant | Quantité | Délai de livraison | Prix unitaire | Acheter | Description | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Memory Size | Technology | Memory Format | Clock Frequency | Write Cycle Time - Word, Page | |
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Alliance Memory,Inc. |
5,799
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Alliance Memory,Inc. |
2,280
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Alliance Memory,Inc. |
4,009
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TFBGA
|
Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 256Mb (16M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Alliance Memory,Inc. |
1,020
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TFBGA
|
Tray | Automotive,AEC-Q100 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 256Mb (16M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Winbond Electronics |
3,538
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | SDRAM | DRAM | 166MHz | - | ||
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Winbond Electronics |
1,420
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | SDRAM | DRAM | 166MHz | - | ||
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Alliance Memory,Inc. |
354
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Winbond Electronics |
2,500
|
3 jours |
-
|
MOQ: 2500 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Tape & Reel (TR) | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | 512Mb (16M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Cut Tape (CT) | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | 512Mb (16M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
2,500
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
- | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | 512Mb (16M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Alliance Memory,Inc. |
436
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 54TSOP
|
Tray | - | 3 V ~ 3.6 V | 0°C ~ 70°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 256Mb (16M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Winbond Electronics |
2,215
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 512M PARALLEL 90VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | 512Mb (16M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
2,207
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 1G PARALLEL 60VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TC) | 60-TFBGA | 60-VFBGA (8x9) | 1Gb (64M x 16) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Alliance Memory,Inc. |
266
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TSOP
|
Tray | Automotive,AEC-Q100 | 3 V ~ 3.6 V | -40°C ~ 105°C (TA) | 54-TSOP (0.400",10.16mm Width) | 54-TSOP II | 128Mb (8M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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Alliance Memory,Inc. |
436
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 54TFBGA
|
Tray | - | 3 V ~ 3.6 V | -40°C ~ 85°C (TA) | 54-TFBGA | 54-TFBGA (8x8) | 128Mb (8M x 16) | SDRAM | DRAM | 166MHz | 12ns | ||
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ISSI,Integrated Silicon Solution Inc |
128
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 2G PARALLEL 90WBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-LFBGA | 90-WBGA (8x13) | 2Gb (64M x 32) | SDRAM - DDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
245
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 60VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 60-TFBGA | 60-VFBGA (8x9) | 128Mb (8M x 16) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
212
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 128M PARALLEL 60VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 60-TFBGA | 60-VFBGA (8x9) | 128Mb (8M x 16) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
164
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -40°C ~ 85°C (TA) | 90-TFBGA | 90-VFBGA (8x13) | 256Mb (8M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns | ||
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Winbond Electronics |
151
|
3 jours |
-
|
MOQ: 1 MPQ: 1
|
IC DRAM 256M PARALLEL 90VFBGA
|
Tray | - | 1.7 V ~ 1.95 V | -25°C ~ 85°C (TC) | 90-TFBGA | 90-VFBGA (8x13) | 256Mb (8M x 32) | SDRAM - Mobile LPDDR | DRAM | 200MHz | 15ns |